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HEC4066BT,118

NXP Semiconductors

HEC4066BT,118 by NXP Semiconductors

SPST; Temperature Grade: INDUSTRIAL; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$0.438

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

$0.438

1k+ parts

$0.363

10k+ parts

$0.324

30,000

-

$0.438

$0.363

$0.324

DigiKey

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.190

30,000

-

-

-

$0.190

Verical

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.454

10k+ parts

$0.405

30,000

-

-

$0.454

$0.405

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,604 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

-

2,604

$0.175

-

-

-

Vyrian

USA . 707 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

-

10k+ parts

-

707

$0.184

-

-

-

Anansix

USA . 1,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,786

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,472 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

1,472

$0.166

-

-

-

Microchip USA

USA . 1,630 parts In-Stock

1+ parts

$0.266

100+ parts

-

1k+ parts

-

10k+ parts

-

1,630

$0.266

-

-

-

UNI Independent Distributors

Spain . 1,422 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,422

-

-

-

-

Native Components

USA . 725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.066

10k+ parts

-

725

-

-

$4.066

-

Northwest PG Solutions

USA . 202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.108

10k+ parts

-

202

-

-

$4.108

-

Technical Specifications

Multiplexers & Switches HEC4066BT,118 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage (Vsup):

0 V

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

5 ohm

Maximum On-state Resistance (Ron):

175 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Maximum Switch-off Time:

140 ns

Maximum Switch-on Time:

30 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

HEC4066BT,118 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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