Loading...

HEC4051BDB

NXP Semiconductors

HEC4051BDB by NXP Semiconductors

HEC4051BDB by NXP Semiconductors is a military-grade CMOS single-ended multiplexer with 8 channels. It operates at a nominal voltage of 15 V, features a max on-state resistance of 175 Ω, and withstands temperatures from -55 °C to 125 °C. Ideal for precision switching in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,609 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,609

-

-

-

-

Vyrian

USA . 2,923 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,923

-

-

-

-

Anansix

USA . 773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

773

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 15 parts In-Stock

1+ parts

$0.061

100+ parts

-

1k+ parts

-

10k+ parts

$0.058

15

$0.061

-

-

$0.058

One Stop Electronics

USA . 824 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

824

$2.500

-

-

-

UNI Independent Distributors

Spain . 5,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,655

-

-

-

-

Northwest PG Solutions

USA . 1,601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,601

-

-

-

-

Corphita

USA . 1,024 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,024

-

-

-

-

Kepictronics

USA . 152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

152

-

-

-

-

Overview

Unlock unparalleled performance with the HEC4051BDB from NXP Semiconductors. Crafted for reliability, this multiplexer excels in demanding environments, delivering exceptional quality you can trust. Its robust design ensures seamless operation across military and industrial applications, while its dual-channel architecture allows for efficient signal management. Choose HEC4051BDB for superior durability, fast switching times, and peace of mind—because your projects deserve the best.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package ensures excellent durability and resistance to environmental factors, making it suitable for challenging applications.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCBs, facilitating compact designs.

Nominal Supply Voltage (Vsup): 15 V

A nominal supply voltage of 15 V allows for versatile use in various electronic applications, providing robust performance.

No. of Terminals: 16

With 16 terminals, this device offers ample connectivity options for complex circuit designs.

Package Style (Meter): IN-LINE

The in-line package style simplifies integration into existing circuit layouts, enhancing assembly efficiency.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliable performance in high-temperature environments.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C allows the device to function in extremely cold conditions, making it suitable for military and aerospace applications.

Terminal Position: DUAL

DUAL terminal positioning provides flexibility in layout design and enhances soldering reliability.

Maximum Seated Height: 5.08 mm

The low seated height of 5.08 mm enables the component to fit into low-profile designs without compromising performance.

Width: 7.62 mm

A compact width of 7.62 mm allows for efficient use of board space, essential in small form-factor electronics.

Other IC Type: SINGLE-ENDED MULTIPLEXER

As a single-ended multiplexer, the product is ideal for applications requiring signal routing with minimal noise and distortion.

Maximum On-state Resistance (Ron): 175 ohm

A maximum on-state resistance of 175 ohm reduces signal loss, enhancing the integrity of the transmitted signals.

Maximum Switch-on Time: 80 ns

Fast switch-on time (80 ns) allows for rapid data transmission, ideally suited for high-speed applications.

Maximum Switch-off Time: 230 ns

With a maximum switch-off time of 230 ns, this device supports quick signal handling, improving overall responsiveness in systems.

Temperature Grade: MILITARY

A military temperature grade signifies the component's capability to withstand harsh operating conditions, suitable for defense applications.

Maximum Supply Current (Isup): 0.6 mA

A low maximum supply current of 0.6 mA contributes to energy efficiency, making it ideal for battery-operated devices.

No. of Channels: 8

With 8 channels, the device supports multiple signal paths, enabling complex signal processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing reliability in various environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure strong physical connections to the PCB, improving durability and reliability of the assembly.

Nominal Negative Supply Voltage (Vsup): 0 V

A nominal negative supply voltage of 0 V simplifies power supply designs, making the device easier to integrate.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard for many applications, ensuring compatibility with a wide range of PCB designs.

Nominal Off-state Isolation: 50 dB

A nominal off-state isolation of 50 dB minimizes crosstalk between channels, ensuring signal integrity in multi-channel applications.

Nominal On-state Resistance Match: 5 ohm

A low on-state resistance match of 5 ohm ensures consistent performance across channels, enhancing reliability and signal fidelity.

Technical Specifications

Multiplexers & Switches HEC4051BDB attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T16

Nominal Negative Supply Voltage (Vsup):

0 V

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

5 ohm

Maximum On-state Resistance (Ron):

175 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current (Isup):

.6 mA

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Maximum Switch-off Time:

230 ns

Maximum Switch-on Time:

80 ns

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

HEC4051BDB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 7