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GTL16612DL

NXP Semiconductors

GTL16612DL by NXP Semiconductors

REGISTERED BUS TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,613 parts In-Stock

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Vyrian

USA . 2,172 parts In-Stock

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Digiode

USA . 1,490 parts In-Stock

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R&J Components

USA . 423 parts In-Stock

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Prism Electronics

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Distributors (Availability)

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Andel Nordic

Denmark . 204 parts In-Stock

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$32.330

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$22.629

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$22.629

204

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$22.629

One Stop Electronics

USA . 982 parts In-Stock

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$38.000

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UNI Independent Distributors

Spain . 5,438 parts In-Stock

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Corphita

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Authorized Procurement Solutions

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Perfect Parts

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Assy Fe

Spain . 1,000 parts In-Stock

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Northwest PG Solutions

USA . 853 parts In-Stock

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Native Components

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Technical Specifications

Bus Driver & Transceivers GTL16612DL attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

TRANSLATES BETWEEN GTL SIGNAL LEVELS AND LVTTL OR 5V TTL SIGNAL LEVELS; CAN ALSO OPERATE AT 3.3V VCC

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTL

JESD-30 Code:

R-PDSO-G56

Length:

18.425 mm

Maximum I (ol):

64 Amp

No. of Bits:

18

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

5.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Translation:

GTL & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

GTL16612DL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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