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GTL1655DGG

NXP Semiconductors

GTL1655DGG by NXP Semiconductors

REGISTERED BUS TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,537 parts In-Stock

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Anansix

USA . 1,346 parts In-Stock

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J2 Sourcing AB

Sweden . 1,000 parts In-Stock

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Digiode

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Martec Srl

Italy . 220 parts In-Stock

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First Choice Components Inc.

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Andel Nordic

Denmark . 369 parts In-Stock

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One Stop Electronics

USA . 1,610 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 5,718 parts In-Stock

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Kepictronics

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UNI Independent Distributors

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Assy Fe

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Northwest PG Solutions

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Corphita

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Native Components

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Cyclops Electronics Ltd (Excess)

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Speed Components Ltd (Excess)

Israel . 109 parts In-Stock

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Technical Specifications

Bus Driver & Transceivers GTL1655DGG attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTL

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Maximum I (ol):

100 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

45 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

GTL/P & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

GTL1655DGG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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