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FS32K144HAT0CLHT

NXP Semiconductors

FS32K144HAT0CLHT by NXP Semiconductors

NXP Semiconductors' FS32K144HAT0CLHT microcontroller features 32-bit CPU, 50 MHz clock frequency, and 65536 bytes of RAM. Ideal for applications requiring CAN, I2C, SPI connectivity and low power mode with Cortex-M4F family for automotive systems.

Median Price

$15.000

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 9,600 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$15.015

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10

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Digiode

USA . 3,717 parts In-Stock

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Vyrian

USA . 2,209 parts In-Stock

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Anansix

USA . 395 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 210 parts In-Stock

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$10.290

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Semicontronic

India . 1,008 parts In-Stock

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$14.625

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$14.550

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Continental Prestige Electronics

USA . 5,079 parts In-Stock

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$15.015

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$14.715

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AZTECH Wire

Italy . 624 parts In-Stock

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$18.695

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Ampacity Inc.

Singapore . 1,057 parts In-Stock

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$23.000

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One Stop Electronics

USA . 1,619 parts In-Stock

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Microchip USA

USA . 2,598 parts In-Stock

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Argo Parts USA

USA . 3,571 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$14.715

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$14.264

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$13.964

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$13.964

Infinite Electronics LLP (Excess)

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Corphita

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UNI Independent Distributors

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Overview

Looking for a reliable microcontroller to power your next project? Look no further than the NXP Semiconductors FS32K144HAT0CLHT. With a powerful Cortex-M4F CPU family, integrated cache, and a wide range of peripherals including ADC channels and PWM, this microcontroller offers unmatched performance and versatility. Whether you're designing industrial automation systems or consumer electronics, the FS32K144HAT0CLHT delivers the quality and value you need to bring your ideas to life. Trust in NXP Semiconductors' reputation for excellence and elevate your designs with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache helps in improving the speed and efficiency of the microcontroller, enhancing overall performance.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in the power supply options, making it compatible with a wide range of systems.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient handling of data within the microcontroller, enhancing processing capabilities.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripheral devices, making the microcontroller versatile in its applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and optimized processing of instructions, leading to improved performance.

ADC Channels: YES

The presence of ADC channels allows for analog signals to be converted to digital data, enabling the microcontroller to interact with the external world.

DMA Channels: YES

Having DMA channels helps in efficient data transfer between peripherals and memory without CPU intervention, reducing the load on the processor.

Maximum Clock Frequency: 50 MHz

The high clock frequency enables fast execution of instructions, making the microcontroller suitable for applications that require high processing speed.

Connectivity: CAN(3), I2C, SPI(3), UART(3)

The multiple connectivity options including CAN, I2C, SPI, and UART allow for seamless communication with other devices, expanding the range of applications.

Technical Specifications

Microcontrollers FS32K144HAT0CLHT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

58

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C, SPI(3), UART(3)

Peripherals:

ANALOG COMPARATOR, CRC, DMA(16), POR, PWM, RTC, TIMER(8), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

FS32K144HAT0CLHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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