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FS32K148UJT0VLQT

NXP Semiconductors

FS32K148UJT0VLQT by NXP Semiconductors

FS32K148UJT0VLQT by NXP Semiconductors is a 32-bit microcontroller with integrated cache and a max clock frequency of 40 MHz. It is commonly used in applications such as automotive systems, industrial control, and consumer electronics.

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Farnell

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Arrow

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Element14

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Verical

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Modulus Dynamics

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Perfect Parts

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Lucentia Tech

USA . 950 parts In-Stock

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$0.189

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Kepictronics

USA . 270 parts In-Stock

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Overview

Experience the next level of performance and reliability with the FS32K148UJT0VLQT microcontroller by NXP Semiconductors. As a leader in semiconductor manufacturing, NXP Semiconductors brings you a product that guarantees superior quality and durability. The FS32K148UJT0VLQT offers unrivaled value with its integrated cache, advanced connectivity options, and extensive range of peripherals. Whether you're designing automotive applications, industrial control systems, or consumer electronics, this microcontroller delivers unmatched speed and efficiency. Unlock endless possibilities with the FS32K148UJT0VLQT and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection for the microcontroller, making it a reliable choice for various applications.

Integrated Cache: YES

The presence of an integrated cache improves the overall performance and speed of the microcontroller, enhancing its ability to handle complex tasks efficiently.

Surface Mount: YES

With surface mount capability, this microcontroller can be easily mounted on PCBs, simplifying the assembly process and making it suitable for compact designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows the microcontroller to operate in a wide range of power supply environments, providing versatility and compatibility for different system configurations.

On Chip Data RAM Width: 8

The 8-bit data RAM width enables efficient storage and retrieval of data within the microcontroller, facilitating smoother operation and improved memory management.

Screening Level: ISO 26262

Compliance with the ISO 26262 screening level ensures that the microcontroller meets the required functional safety standards, making it a reliable choice for safety-critical applications.

Package Shape: SQUARE

The square package shape offers ease of integration and placement on PCBs, providing flexibility and compatibility with standard PCB layouts.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers increased processing power, allowing for complex calculations and advanced functionalities in various applications.

No. of Terminals: 144

The high number of terminals provides extensive connectivity options for peripheral devices, enabling the microcontroller to interface with a wide range of components for versatile system integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving advantages, making it suitable for compact designs and electronics with limited physical dimensions.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage allows the microcontroller to operate in low-power environments, promoting energy efficiency and extending battery life in portable applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance ensures the microcontroller's reliable performance even in demanding thermal conditions, making it suitable for industrial and automotive applications.

CPU Family: CORTEX-M4F

Based on the Cortex-M4F CPU family, this microcontroller provides a balance between performance and power efficiency, making it well-suited for a wide range of applications that require real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance allows the microcontroller to function reliably even in harsh environmental conditions, expanding its suitability for various outdoor and industrial applications.

Terminal Finish: TIN

The use of tin as the terminal finish ensures reliable electrical connections and prevents oxidation, enhancing the microcontroller's longevity and performance.

ADC Channels: YES

The availability of analog-to-digital converter (ADC) channels allows the microcontroller to measure and process analog signals, enabling it to interface with sensors and perform precise analog-to-digital conversions.

DMA Channels: YES

With built-in direct memory access (DMA) channels, the microcontroller can efficiently transfer data between peripherals and memory, reducing the CPU's workload and improving system performance.

Terminal Position: QUAD

The quad terminal position provides convenient accessibility for connecting external devices and peripherals, facilitating ease of integration and enhancing the microcontroller's overall usability.

ROM Words: 2097152

With a significant capacity of 2097152 ROM words, this microcontroller can store a large amount of program code, allowing for complex and extensive firmware implementations in various applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height ensures compatibility with slim form factors and contributes to a compact overall system design, making it suitable for space-constrained applications.

Digital To Analog Convertors: 1-Ch 8-Bit

The built-in 8-bit digital-to-analog converter (DAC) enables the microcontroller to generate analog output signals, opening up opportunities for interfacing with analog devices and systems.

Width: 20 mm

With a compact width of 20 mm, this microcontroller offers space-saving advantages, enabling it to be easily integrated into various electronic designs with limited physical dimensions.

Data EEPROM Size: 4096

The ample data EEPROM size of 4096 allows for reliable data storage and retention, making it suitable for applications that require non-volatile memory for storing critical information.

Boundary Scan: YES

The inclusion of boundary scan capability enables efficient testing and debugging of the microcontroller's pins and interfaces during production, ensuring quality and facilitating troubleshooting.

Peripherals: BOR, COMPARATOR, POR, RTC, TIMER(66), WDT

The presence of various peripherals, including Brown-Out Reset (BOR), comparator, power-on reset (POR), real-time clock (RTC), timers (66), and watchdog timer (WDT), provides enhanced functionality and versatility for diverse application requirements.

Maximum Clock Frequency: 40 MHz

With a maximum clock frequency of 40 MHz, this microcontroller can execute instructions and process data at high speeds, enabling quick and responsive operation in time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand peak reflow temperature for up to 40 seconds simplifies the manufacturing process, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures proper solder joint formation during the manufacturing process, enhancing the microcontroller's overall reliability.

Length: 20 mm

With a compact length of 20 mm, this microcontroller offers space-saving benefits, making it suitable for designs with strict size constraints.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with a reduced instruction set computer (RISC) architecture, it provides efficient execution of instructions, enabling faster data processing and improved performance.

No. of Timers: 66

The abundance of 66 timers allows for versatile timing and scheduling functionalities, facilitating precise control and synchronization of various tasks in complex applications.

RAM Bytes: 262144

With a generous capacity of 262144 bytes of random access memory (RAM), the microcontroller can efficiently store and manipulate data, promoting the execution of sophisticated algorithms and enabling multitasking capabilities.

Technology: CMOS

Based on CMOS technology, this microcontroller offers low power consumption, reduced noise, and improved noise immunity, making it suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust mechanical connections, ensuring reliable operation and compatibility with standard PCB assembly processes.

Analog To Digital Convertors: 32-Ch 12-Bit

With 32-channel 12-bit analog-to-digital converters (ADCs), the microcontroller can accurately sample and process analog signals from a wide range of sensors and transducers, making it suitable for precise measurement and data acquisition applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V enables compatibility with a wide range of power sources, making this microcontroller suitable for both industrial and consumer electronics applications.

No. of DMA Channels: 16

The availability of 16 direct memory access (DMA) channels allows for efficient data transfer between peripherals and memory, reducing CPU overhead and enhancing overall system performance.

No. of Serial I/Os: 3

With three serial input/output (I/O) interfaces, the microcontroller can communicate with external devices using popular serial protocols, expanding connectivity and enabling seamless integration into various communication systems.

PWM Channels: YES

The availability of pulse-width modulation (PWM) channels allows the microcontroller to generate precise analog-like output signals, facilitating control of motors, LEDs, and other applications that require adjustable output voltages.

Connectivity: CAN(3), I2C(2), LIN(3), LPUART(3), SAI(2), SPI(3)

This microcontroller offers multiple connectivity options, including Controller Area Network (CAN), inter-integrated circuit (I2C), Local Interconnect Network (LIN), Low-Power UART (LPUART), serial audio interface (SAI), and serial peripheral interface (SPI), enabling seamless integration and communication with various external devices and networks.

ROM Programmability: FLASH

The programmability of the microcontroller's read-only memory (ROM) using flash technology allows for easy firmware updates and modifications, enhancing flexibility and adaptability for evolving application requirements.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm enables high-density PCB layouts, allowing for miniaturized designs and efficient use of board space.

Format: FLOATING-POINT

Supporting floating-point format, this microcontroller can handle complex mathematical calculations with high accuracy, making it suitable for applications that require precise numerical computations.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the microcontroller is capable of withstanding moderate moisture levels during storage and transportation, ensuring long-term reliability and reducing the risk of device failure.

Speed: 112 rpm

The speed of 112 rotations per minute (rpm) implies that this microcontroller can efficiently execute tasks and process data at high speeds, contributing to the responsiveness and performance of time-sensitive applications.

Low Power Mode: YES

With low power mode capabilities, the microcontroller can enter energy-saving states during periods of inactivity, conserving power and extending battery life in portable and battery-powered applications.

Technical Specifications

Microcontrollers FS32K148UJT0VLQT attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

128

No. of Serial I/Os:

3

No. of Terminals:

144

No. of Timers:

66

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.6 mm

Speed:

112 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

4096

Connectivity:

CAN(3), I2C(2), LIN(3), LPUART(3), SAI(2), SPI(3)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(66), WDT

Analog To Digital Convertors:

32-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

FS32K148UJT0VLQT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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