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DC6M602X6/1518A,13

NXP Semiconductors

DC6M602X6/1518A,13 by NXP Semiconductors

DC6M602X6/1518A,13 from NXP Semiconductors is a compact switching regulator designed for industrial applications. It operates in a voltage-mode control with a max output current of 0.65 A and supports high-frequency switching up to 6600 kHz. Its robust design withstands temperatures from -40 °C to 85 °C, making it ideal for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,997 parts In-Stock

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5,997

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Digiode

USA . 1,865 parts In-Stock

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1,865

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Anansix

USA . 679 parts In-Stock

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679

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Distributors (Availability)

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Native Components

USA . 384 parts In-Stock

1+ parts

$0.126

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$0.121

384

$0.126

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$0.121

Northwest PG Solutions

USA . 1,697 parts In-Stock

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$0.139

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$0.122

1,697

$0.139

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$0.122

Microchip USA

USA . 376 parts In-Stock

1+ parts

$0.753

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376

$0.753

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One Stop Electronics

USA . 307 parts In-Stock

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$6.500

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307

$6.500

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AZTECH Wire

Italy . 759 parts In-Stock

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$14.710

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759

$14.710

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Component Stockers USA

USA . 295 parts In-Stock

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$99.990

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295

$99.990

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UNI Independent Distributors

Spain . 2,097 parts In-Stock

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2,097

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Corphita

USA . 2,055 parts In-Stock

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2,055

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Overview

Elevate your design with the DC6M602X6/1518A,13 from NXP Semiconductors—where quality meets innovation. Engineered for reliability in demanding environments, this switching regulator ensures optimal performance while maximizing efficiency. With a robust temperature range and superior control mode, it’s perfect for industrial applications requiring precision. Trust NXP's legacy of excellence to enhance your projects and deliver unmatched value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, enhancing the product's longevity and reliability.

Surface Mount: YES

This surface mount capability allows for more efficient use of PCB real estate, facilitating compact and densely populated circuit designs.

Package Shape: RECTANGULAR

The rectangular shape is optimal for heat dissipation and functionality, enabling better layout flexibility on circuit boards.

No. of Terminals: 6

With six terminals, this component offers sufficient connectivity options for versatile applications in complex circuit configurations.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design improves signal integrity and reduces parasitic inductance, enhancing overall performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-temperature environments, making it suitable for industrial applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides stable operation and improved transient response, making it ideal for maintaining steady output voltage.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this regulator is designed for extreme temperature conditions, enhancing its applicability in harsh environments.

Terminal Position: BOTTOM

Bottom terminal positioning allows for convenient soldering and assembly, facilitating automated manufacturing processes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees performance stability and reliability in varying industrial conditions, ensuring consistent operation.

Maximum Switching Frequency: 6600 kHz

A high switching frequency of 6600 kHz allows for smaller passive components and improved efficiency, optimizing the design for compact applications.

Maximum Output Current: 0.65 A

An output current of 0.65 A provides enough power for many applications, making it versatile for various designs and requirements.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and ensures good solder joint quality, enhancing overall assembly integrity.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for high-density packing on PCBs, enabling more compact circuit designs without sacrificing performance.

Technical Specifications

Switching Regulators & Controllers DC6M602X6/1518A,13 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PBGA-B6

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.65 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

6600 kHz

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

DC6M602X6/1518A,13 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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