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DC6M401X6/18S,135

NXP Semiconductors

DC6M401X6/18S,135 by NXP Semiconductors

DC6M401X6/18S,135 by NXP Semiconductors is a compact switching regulator designed for industrial applications. It operates in a voltage-mode control with a max output current of 0.425 A and supports high-frequency switching up to 6600 kHz. Its robust design withstands temperatures from -40 °C to 85 °C, making it ideal for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,817 parts In-Stock

1+ parts

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3,817

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Digiode

USA . 3,584 parts In-Stock

1+ parts

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3,584

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Anansix

USA . 1,546 parts In-Stock

1+ parts

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1,546

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 166 parts In-Stock

1+ parts

$0.500

100+ parts

-

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166

$0.500

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Microchip USA

USA . 440 parts In-Stock

1+ parts

$0.747

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440

$0.747

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Native Components

USA . 32 parts In-Stock

1+ parts

$5.155

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32

$5.155

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Corphita

USA . 4,691 parts In-Stock

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4,691

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UNI Independent Distributors

Spain . 2,975 parts In-Stock

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2,975

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Northwest PG Solutions

USA . 668 parts In-Stock

1+ parts

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100+ parts

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$5.052

10k+ parts

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668

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$5.052

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Overview

Unlock unparalleled performance with the DC6M401X6/18S,135 by NXP Semiconductors, a top-tier solution in switching regulators. Designed for resilience in demanding environments, this compact device combines reliability with efficiency, delivering optimal power management for your industrial applications. Trust NXP’s legacy of innovation to ensure exceptional quality and seamless integration, empowering you to elevate your projects with confidence. Embrace precision and durability today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for compact designs and simplifies automated assembly, making it ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape provides flexibility in layout and PCB design, making it easier to integrate into different systems.

No. of Terminals: 6

Having six terminals allows for greater connectivity and functionality in a compact footprint, suitable for complex applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array design reduces space requirements, making it easier to incorporate into high-density PCB layouts.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is reliable for operation in moderately harsh environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers simple design implementation with effective voltage regulation, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature ensures rugged performance in extreme cold environments, making it a versatile choice.

Terminal Position: BOTTOM

Bottom terminal positioning allows for a more straightforward integration into various PCB layouts, saving space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies reliability and robustness, suitable for demanding applications.

Maximum Switching Frequency: 6600 kHz

A high switching frequency of 6600 kHz enhances performance by allowing for smaller inductors and capacitors, reducing overall system size.

Maximum Output Current: 0.425 A

Supporting a maximum output current of 0.425 A ensures adequate power delivery for various applications, from small devices to larger systems.

Terminal Form: BALL

The ball terminal form provides effective thermal and electrical performance, facilitating soldering and assembly processes.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm is ideal for high-density designs, allowing for efficient use of space while maintaining robust connections.

Technical Specifications

Switching Regulators & Controllers DC6M401X6/18S,135 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PBGA-B6

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.425 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

6600 kHz

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

DC6M401X6/18S,135 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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