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DC6M502X6/1218F,13

NXP Semiconductors

DC6M502X6/1218F,13 by NXP Semiconductors

DC6M502X6/1218F,13 by NXP Semiconductors is a compact switching regulator designed for industrial applications. It operates in a voltage-mode control with a max output current of 0.5 A and supports temperatures from -40 °C to 85 °C. Its fine pitch grid array package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,992 parts In-Stock

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3,992

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Anansix

USA . 2,829 parts In-Stock

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2,829

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Vyrian

USA . 602 parts In-Stock

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602

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 191 parts In-Stock

1+ parts

$6.500

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191

$6.500

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Microchip USA

USA . 375 parts In-Stock

1+ parts

$27.696

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375

$27.696

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$28.460

100+ parts

$25.899

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$23.337

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550

$28.460

$25.899

$23.337

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Component Stockers USA

USA . 527 parts In-Stock

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$99.990

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527

$99.990

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Native Components

USA . 783 parts In-Stock

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$128.583

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$123.439

783

$128.583

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$123.439

Northwest PG Solutions

USA . 1,435 parts In-Stock

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$141.441

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1,435

$141.441

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UNI Independent Distributors

Spain . 7,554 parts In-Stock

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7,554

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QUARKTWIN TECHNOLOGY LTD

USA . 4,053 parts In-Stock

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4,053

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Corphita

USA . 2,200 parts In-Stock

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2,200

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Overview

Unlock the power of innovation with the DC6M502X6/1218F,13 from NXP Semiconductors! Designed for precision and reliability, this advanced switching regulator excels in various industrial applications. Offering robust performance in extreme temperatures, it ensures efficiency without compromise. Trust in NXP's legacy of quality, and elevate your projects with a solution that guarantees stability and superior output, maximizing your operational success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, ensuring long-lasting performance in various applications.

Surface Mount: YES

The surface mount design allows for efficient use of PCB space and facilitates automated assembly, making this product suitable for high-density applications.

Package Shape: RECTANGULAR

The rectangular package shape enhances the product's footprint on the PCB, making it easier to integrate into various layouts.

No. of Terminals: 6

With six terminals, this switching regulator provides versatile connectivity options, enabling flexible circuit designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array style supports advanced functionality in compact spaces, making it ideal for modern electronic designs.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliable performance in moderate thermal environments, suitable for a wide range of industrial applications.

Control Mode: VOLTAGE-MODE

The voltage-mode control provides stable and precise output voltage regulation, enhancing performance in power-sensitive applications.

Minimum Operating Temperature: -40 °C

The capability to operate as low as -40 °C makes this product suitable for extreme environmental conditions, ensuring reliable functionality in harsh settings.

Terminal Position: BOTTOM

Bottom terminal positioning offers optimal thermal performance and efficient electrical connectivity, enhancing overall product reliability.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designates this product as suitable for demanding industrial applications where temperature fluctuations are common.

Maximum Switching Frequency: 6600 kHz

With a high switching frequency, this regulator enables efficient power conversion, reducing the size of passive components in the circuit.

Maximum Output Current: 0.5 A

A maximum output current of 0.5 A provides adequate power for a range of devices, making this regulator versatile for various applications.

Terminal Form: BALL

Ball terminal form ensures reliable solder connections, enhancing product durability and performance in high-reliability applications.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm is well-suited for compact PCB designs, accommodating modern electronic demands for smaller yet powerful components.

Technical Specifications

Switching Regulators & Controllers DC6M502X6/1218F,13 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PBGA-B6

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

6600 kHz

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

DC6M502X6/1218F,13 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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