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DC6M501X6/15S,135

NXP Semiconductors

DC6M501X6/15S,135 by NXP Semiconductors

DC6M501X6/15S,135 by NXP Semiconductors is a compact switching regulator designed for industrial applications. It operates in a voltage-mode control with a max output current of 0.5 A and supports high-frequency switching up to 6600 kHz. With an operating temp range of -40 °C to 85 °C, it ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,935 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,935

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Anansix

USA . 2,262 parts In-Stock

1+ parts

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1k+ parts

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2,262

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Digiode

USA . 493 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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493

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,364 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,364

$0.500

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Microchip USA

USA . 269 parts In-Stock

1+ parts

$0.794

100+ parts

-

1k+ parts

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10k+ parts

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269

$0.794

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UNI Independent Distributors

Spain . 1,915 parts In-Stock

1+ parts

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1,915

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Corphita

USA . 1,006 parts In-Stock

1+ parts

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1,006

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Northwest PG Solutions

USA . 995 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.322

10k+ parts

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995

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$4.322

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Native Components

USA . 518 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$4.278

10k+ parts

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518

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$4.278

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Overview

Elevate your designs with the DC6M501X6/15S,135 from NXP Semiconductors, a leader in innovative solutions. This compact switching regulator offers reliable performance across extreme temperatures, ensuring stability in various applications—from industrial automation to consumer electronics. With its high efficiency and robust build, it minimizes energy waste while maximizing output, giving you peace of mind and enhancing your product's longevity. Choose quality with NXP and power your projects confidently!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resilience, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for a compact design and facilitates automated assembly processes, contributing to lower production costs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on printed circuit boards, enabling more efficient layouts.

No. of Terminals: 6

With 6 terminals, this product can ensure good connectivity and functionality, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style allows for a high density of connections, ensuring effective and reliable performance in compact spaces.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in high-temperature environments, enhancing product longevity.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides better transient response and stability, making this product ideal for precise power regulation.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this product suitable for harsh environments and demanding applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient thermal dissipation and excellent mechanical stability on PCBs.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature grades, this product is well-suited for a variety of challenging industrial and outdoor applications.

Maximum Switching Frequency: 6600 kHz

A high maximum switching frequency of 6600 kHz allows for smaller inductive components and improved efficiency in power conversion.

Maximum Output Current: 0.5 A

0.5 A output current capability provides sufficient power for numerous applications, ensuring versatility in design.

Terminal Form: BALL

Ball terminal form provides reliable connections and enhances soldering efficiency, crucial for high-performance applications.

Terminal Pitch: 0.4 mm

0.4 mm terminal pitch enables high-density designs, making the product suitable for compact electronic devices.

Technical Specifications

Switching Regulators & Controllers DC6M501X6/15S,135 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PBGA-B6

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

6600 kHz

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

DC6M501X6/15S,135 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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