Loading...

CBTV4020EE/G-T

NXP Semiconductors

CBTV4020EE/G-T by NXP Semiconductors

CBTV4020EE/G-T by NXP Semiconductors is a robust bus driver and transceiver featuring a 2.5V nominal voltage, 72 terminals in a fine pitch grid array, and operates b/w 0 °C to 85 °C. Ideal for compact electronic applications, it ensures reliable performance in space-constrained designs. Its surface mount design enhances integration into modern circuit boards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,191

-

-

-

-

Anansix

USA . 886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

886

-

-

-

-

Vyrian

USA . 62 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

62

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 512 parts In-Stock

1+ parts

$4.630

100+ parts

-

1k+ parts

$4.445

10k+ parts

$4.445

512

$4.630

-

$4.445

$4.445

One Stop Electronics

USA . 1,522 parts In-Stock

1+ parts

$13.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,522

$13.000

-

-

-

UNI Independent Distributors

Spain . 6,010 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,010

-

-

-

-

Corphita

USA . 3,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,263

-

-

-

-

Northwest PG Solutions

USA . 1,217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,217

-

-

-

-

Native Components

USA . 257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

257

-

-

-

-

Overview

Elevate your design with the CBTV4020EE/G-T from NXP Semiconductors, a premier solution in bus drivers and transceivers. Crafted for reliability and performance, this high-quality device ensures seamless data transmission across various applications. With robust manufacturing backing, it promises longevity and efficiency, empowering your projects to thrive while simplifying circuit designs. Experience unparalleled value and innovative advantages that set you apart!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the longevity and reliability of the product, making it ideal for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, saving space on the PCB and facilitating higher-density layouts.

Package Shape: SQUARE

The square package shape provides uniformity in layout, ensuring efficient use of PCB space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal voltage of 2.5V is suitable for modern digital applications, enabling efficient power consumption and compatibility with low-voltage systems.

Power Supplies (V): 2.5

Supporting a power supply of 2.5V ensures harmonization with contemporary components, enhancing overall circuit performance and energy efficiency.

No. of Terminals: 72

With 72 terminals, this product offers extensive connectivity options, making it versatile for various applications and enhancing its functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array design supports a high density of connections, crucial for advanced applications that require efficient use of limited space.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C indicates robust thermal stability, making the product suitable for high-performance applications where heat dissipation is critical.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, the product is well-suited for environments exposed to varying temperatures, enhancing its operational reliability.

Terminal Position: BOTTOM

Bottom terminal placement allows for efficient thermal management and simplifies the soldering process, improving manufacturing efficiency.

Terminal Form: BALL

Ball terminal form ensures consistent electrical connectivity while accommodating expansion and contraction due to thermal fluctuations.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density packaging, making the product suitable for applications with space constraints without compromising performance.

Technical Specifications

Bus Driver & Transceivers CBTV4020EE/G-T attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B72

Logic IC Type:

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA72,10X10,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

2.5

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

CBTV4020EE/G-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 4