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BUK9C07-65BIT,118

NXP Semiconductors

BUK9C07-65BIT,118 by NXP Semiconductors

BUK9C07-65BIT,118 by NXP Semiconductors is a single N-channel MOSFET designed for high-performance applications. It supports a max drain current of 75 A and power dissipation of 245 W, operating up to 150 °C. Ideal for efficient power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 158,000 parts In-Stock

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Vyrian

USA . 7,583 parts In-Stock

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Anansix

USA . 949 parts In-Stock

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Digiode

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Native Components

USA . 294 parts In-Stock

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$1.650

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Northwest PG Solutions

USA . 1,111 parts In-Stock

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$1.815

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AZTECH Wire

Italy . 790 parts In-Stock

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$9.510

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One Stop Electronics

USA . 920 parts In-Stock

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Corphita

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UNI Independent Distributors

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Overview

Unlock unparalleled performance with the BUK9C07-65BIT,118 from NXP Semiconductors, a leader in innovative technology. This high-quality power FET delivers exceptional efficiency and reliability for a range of applications from automotive to industrial systems. Experience superior thermal management and robust current handling, ensuring your designs thrive under demanding conditions. Choose NXP for trusted quality that empowers your projects to excel.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, resulting in faster switching speeds and improved efficiency, making them ideal for high-performance applications.

Configuration: SINGLE

A single configuration simplifies the design and reduces the space required on PCBs, making it easier to integrate into various electronic circuits.

Surface Mount: YES

Surface mount technology (SMT) allows for compact designs, improving space utilization and enabling high-density circuit layouts.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide high input impedance and low off-state current, ensuring better energy efficiency and lower power losses during operation.

Maximum Drain Current (Abs) (ID): 75 A

The high maximum drain current rating allows the FET to handle demanding applications and increased load requirements without risk of failure.

Maximum Power Dissipation (Abs): 245 W

A high power dissipation rating ensures that the device can efficiently manage heat generated during operation, enhancing reliability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to high-speed switching and low power consumption, making this FET ideal for a variety of modern electronic applications.

Maximum Operating Temperature: 150 °C

The ability to function at high temperatures increases the versatility of this FET, making it suitable for applications in harsh thermal environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term durability in various applications.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds supports compatibility with modern manufacturing processes, ensuring effective assembly without damaging the component.

Peak Reflow Temperature: 245 °C

A peak reflow temperature of 245 °C ensures reliability during the soldering process, allowing for optimal thermal profiles in manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) BUK9C07-65BIT,118 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BUK9C07-65BIT,118 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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