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BUK7K25-40E

NXP Semiconductors

BUK7K25-40E by NXP Semiconductors

NXP Semiconductors' BUK7K25-40E is an N-channel Power FET with 40V DS breakdown voltage and 0.025 ohm max RDS(on). Ideal for switching applications, it features separate elements with built-in diode, 107A pulsed drain current, and 10mJ avalanche energy rating. Suitable for enhancement mode operation in automotive electronics (AEC-Q101) and industrial automation (IEC-60134).

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Vyrian

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Digiode

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Lantek

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Nova Conductors

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AZTECH Wire

Italy . 13,224 parts In-Stock

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Semicontronic

India . 1,372 parts In-Stock

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One Stop Electronics

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Overview

Power up your projects with the BUK7K25-40E by NXP Semiconductors, a high-quality Power Field Effect Transistor designed for switching applications. With a durable plastic/epoxy package and N-channel configuration, this transistor offers reliable performance and efficiency. Perfect for enhancing your electronic designs, this transistor has a maximum pulsed drain current of 107A and a low on-resistance of 0.025 ohm. Trust in NXP Semiconductors for top-notch semiconductor technology and elevate your projects with the BUK7K25-40E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the FET, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher efficiency compared to P-Channel FETs, making them suitable for various switching applications.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage allows for safe operation in high voltage applications without the risk of damaging the FET.

Maximum Pulsed Drain Current (IDM): 107 A

The high maximum pulsed drain current rating ensures that the FET can handle transient spikes of current without failure, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 10 mJ

The low avalanche energy rating indicates that the FET can withstand energy spikes during switching operations, ensuring reliable performance under stress.

Maximum Drain-Source On Resistance: 0.025 ohm

The low ON resistance leads to reduced power losses and heat generation, making the FET energy efficient and suitable for high-frequency switching applications.

Technical Specifications

Power Field Effect Transistors (FET) BUK7K25-40E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

10 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

107 A

Reference Standard:

AEC-Q101; IEC-60134

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BUK7K25-40E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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