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BSS83,215

NXP Semiconductors

BSS83,215 by NXP Semiconductors

NXP Semiconductors' BSS83,215 is a N-CHANNEL FET with 10V DS Breakdown Voltage and 0.05A Drain Current. Ideal for SWITCHING applications, it features SINGLE configuration with built-in diode in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has a max power dissipation of 0.23W at 125°C.

Median Price

$291.662

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Nova Conductors

Japan . 500 parts In-Stock

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$583.099

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VNN

France . 5,533 parts In-Stock

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Vyrian

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ComSIT Distribution GmbH

Germany . 2,925 parts In-Stock

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Bristol Electronics

USA . 2,551 parts In-Stock

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$0.225

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A2Z Electronics, Inc.

USA . 1,830 parts In-Stock

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Digiode

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Anansix

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Prism Electronics

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One Stop Electronics

USA . 531 parts In-Stock

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$4.050

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$4.050

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Ampacity Inc.

Singapore . 1,570 parts In-Stock

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$14.050

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AZTECH Wire

Italy . 375 parts In-Stock

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Continental Prestige Electronics

USA . 6,250 parts In-Stock

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$571.437

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Argo Parts USA

USA . 579 parts In-Stock

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$577.268

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$571.437

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$565.606

579

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$565.606

Netroflash

USA . 500 parts In-Stock

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$571.437

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UNI Independent Distributors

Spain . 7,037 parts In-Stock

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Perfect Parts

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Corphita

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Microchip USA

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Overview

Discover the cutting-edge BSS83,215 Small Signal Field Effect Transistor by NXP Semiconductors, designed for high-quality switching applications. Crafted with precision and expertise, NXP Semiconductors delivers top-notch performance and reliability. Ideal for a range of electronic devices, this N-CHANNEL transistor offers unparalleled efficiency and power management. Upgrade your projects with the BSS83,215 and experience superior functionality like never before. Unlock endless possibilities with this innovative solution from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor components, ensuring reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the transistor and surrounding circuitry from reverse voltage spikes, enhancing overall robustness.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and fast operation in various electronic circuits.

Surface Mount: YES

Easy to mount on PCBs, saving space and facilitating automated assembly processes.

Maximum Drain Current (ID): 0.05 A

Can handle moderate current levels, suitable for low-power applications where efficiency is important.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers good performance characteristics and low leakage current, ideal for power management and signal processing applications.

Maximum Operating Temperature: 125 °C

Can withstand relatively high temperatures, making it suitable for applications where heat dissipation is a concern.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS83,215 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SUBSTRATE

Minimum DS Breakdown Voltage:

10 V

Maximum Drain Current (Abs) (ID):

.05 A

Maximum Drain Current (ID):

.05 A

Maximum Drain-Source On Resistance:

120 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS83,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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