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BLA0912-250R,112

NXP Semiconductors

BLA0912-250R,112 by NXP Semiconductors

BLA0912-250R,112 by NXP Semiconductors is an N-channel enhancement mode FET designed for high-power applications. It features a max power dissipation of 700 W and operates effectively up to 200 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,237 parts In-Stock

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Digiode

USA . 4,052 parts In-Stock

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4,052

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Anansix

USA . 1,311 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 180 parts In-Stock

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$10.400

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180

$10.400

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Native Components

USA . 242 parts In-Stock

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$14.615

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242

$14.615

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Northwest PG Solutions

USA . 1,422 parts In-Stock

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$16.076

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$14.469

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$16.076

$14.469

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One Stop Electronics

USA . 789 parts In-Stock

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$42.050

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789

$42.050

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QUARKTWIN TECHNOLOGY LTD

USA . 14,953 parts In-Stock

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14,953

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UNI Independent Distributors

Spain . 4,492 parts In-Stock

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Corphita

USA . 248 parts In-Stock

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248

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Overview

Unleash superior performance with the BLA0912-250R,112 N-channel FET from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a robust solution that excels in demanding applications, offering exceptional efficiency and reliability. With its impressive power handling capabilities and high operating temperatures, this transistor ensures your designs perform flawlessly, enhancing longevity and reducing maintenance costs—perfect for automotive, industrial, and consumer electronics. Experience unparalleled value and peace of mind with NXP's trusted technology!

Feature Benefit Bullets

Polarity/Channel Type: N-CHANNEL

N-Channel FETs are known for their high electron mobility, which allows for faster switching speeds and greater efficiency, making them ideal for power applications.

Configuration: SINGLE

A single configuration allows for simpler designs and reduced complexity in circuits, making it easier to integrate into various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides greater control and allows the device to fully turn off when not in use, improving energy efficiency and reducing power loss.

Maximum Power Dissipation (Abs): 700 W

With a maximum power dissipation of 700 W, this FET can handle high load conditions, making it suitable for demanding applications and ensuring reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making this FET an excellent choice for battery-operated devices and power-sensitive applications.

Maximum Operating Temperature: 200 °C

A maximum operating temperature of 200 °C allows for reliable performance in high-temperature environments, broadening its application range in various industrial settings.

Technical Specifications

Power Field Effect Transistors (FET) BLA0912-250R,112 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Trade Compliance

BLA0912-250R,112 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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