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BGA3131J

NXP Semiconductors

BGA3131J by NXP Semiconductors

CONSUMER CIRCUIT; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

$3.681

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6,000 parts In-Stock

1+ parts

$3.330

100+ parts

$2.503

1k+ parts

$2.193

10k+ parts

$1.991

6,000

$3.330

$2.503

$2.193

$1.991

Arrow

USA . 5,997 parts In-Stock

1+ parts

$3.681

100+ parts

$3.572

1k+ parts

$3.007

10k+ parts

$2.887

5,997

$3.681

$3.572

$3.007

$2.887

Chip1Stop

Japan . 5,997 parts In-Stock

1+ parts

$3.681

100+ parts

$3.572

1k+ parts

$3.007

10k+ parts

$2.887

5,997

$3.681

$3.572

$3.007

$2.887

Mouser Electronics

USA . 5,892 parts In-Stock

1+ parts

$5.090

100+ parts

$2.610

1k+ parts

$1.960

10k+ parts

$1.840

5,892

$5.090

$2.610

$1.960

$1.840

Verical

USA . 5,997 parts In-Stock

1+ parts

-

100+ parts

$3.572

1k+ parts

$3.007

10k+ parts

$2.887

5,997

-

$3.572

$3.007

$2.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,643 parts In-Stock

1+ parts

$3.497

100+ parts

-

1k+ parts

-

10k+ parts

-

1,643

$3.497

-

-

-

Vyrian

USA . 2,431 parts In-Stock

1+ parts

$3.572

100+ parts

-

1k+ parts

-

10k+ parts

-

2,431

$3.572

-

-

-

Flip Electronics

USA . 5,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,890

-

-

-

-

Chip Stock

USA . 2,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,734

-

-

-

-

Anansix

USA . 1,465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,465

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,996 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

-

10k+ parts

-

4,996

$3.040

-

-

-

Corphita

USA . 4,928 parts In-Stock

1+ parts

$3.313

100+ parts

-

1k+ parts

-

10k+ parts

-

4,928

$3.313

-

-

-

Microchip USA

USA . 417 parts In-Stock

1+ parts

$4.140

100+ parts

$4.140

1k+ parts

$4.140

10k+ parts

$4.140

417

$4.140

$4.140

$4.140

$4.140

Native Components

USA . 516 parts In-Stock

1+ parts

$8.870

100+ parts

-

1k+ parts

-

10k+ parts

-

516

$8.870

-

-

-

Northwest PG Solutions

USA . 528 parts In-Stock

1+ parts

$9.757

100+ parts

$8.781

1k+ parts

-

10k+ parts

-

528

$9.757

$8.781

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,852

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,071 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,071

-

-

-

-

UNI Independent Distributors

Spain . 5,964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,964

-

-

-

-

Metaverse IC Inc.

Canada . 5,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,850

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Alle Elektronik GmbH

Germany . 4,714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,714

-

-

-

-

Technical Specifications

Other Function Consumer ICs BGA3131J attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BGA3131J General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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