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BGA3031

NXP Semiconductors

BGA3031 by NXP Semiconductors

BGA3031 from NXP Semiconductors is a compact consumer IC designed for surface mount applications. It features a 20-terminal quad layout with a very thin profile of just 1 mm height, ideal for space-constrained designs. This versatile chip is perfect for various consumer electronics.

Median Price

$0.810

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 1,000 parts In-Stock

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Flip Electronics (Authorized)

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Flip Electronics

USA . 361,000 parts In-Stock

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Vyrian

USA . 6,556 parts In-Stock

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Digiode

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Anansix

USA . 2,531 parts In-Stock

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DigiKey Marketplace

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$0.821

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Distributors (Availability)

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Native Components

USA . 859 parts In-Stock

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$15.690

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Northwest PG Solutions

USA . 474 parts In-Stock

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$15.533

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QUARKTWIN TECHNOLOGY LTD

USA . 21,924 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 5,151 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,434 parts In-Stock

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Corphita

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Metaverse IC Inc.

Canada . 2,570 parts In-Stock

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ChipstoGo Electronic ltd

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UNI Independent Distributors

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Overview

Elevate your designs with the BGA3031 from NXP Semiconductors, a trusted leader in innovative solutions. This sleek, square consumer IC delivers exceptional performance and reliability, making it perfect for diverse applications from smart appliances to wearable technology. With its compact size and superior heat management, the BGA3031 ensures efficiency and longevity, empowering you to create cutting-edge products that stand out in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the IC reliable for various consumer applications.

Surface Mount: YES

Surface mount capability allows for a compact design and facilitates automated assembly, leading to lower manufacturing costs and improved performance.

Package Shape: SQUARE

The square package shape optimizes space on PCBs, making it easier to incorporate into compact designs, ideal for modern consumer electronics.

General IC Type: CONSUMER CIRCUIT

Being categorized as a consumer circuit IC indicates its suitability for everyday electronics, enhancing functionality in commonly used devices.

No. of Terminals: 20

With 20 terminals, this IC offers flexibility in design and allows for multiple connections, making it versatile for various applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and inclusion of a heat sink/slug facilitate efficient thermal management and make integration into slim devices possible without overheating.

Terminal Position: QUAD

Quad terminal positioning optimizes layout and connection possibilities on a PCB, ensuring efficient space utilization and easy routing of signals.

Maximum Seated Height: 1 mm

A maximum seated height of just 1 mm allows for low-profile designs, essential for today's slim consumer electronics.

Width: 5 mm

At a width of 5 mm, this IC is compact, enabling more efficient use of board space and contributing to the overall slimness of the product design.

Length: 5 mm

A length of 5 mm makes it convenient for small device applications, ensuring it fits well within tight spaces without sacrificing functionality.

Terminal Form: NO LEAD

No lead terminals minimize PCB footprint and help in enhancing the IC’s performance by reducing inductance and improving signal integrity.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a denser arrangement of connections, making it suitable for high-performance applications in limited spaces.

Technical Specifications

Other Function Consumer ICs BGA3031 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N20

Length:

5 mm

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

BGA3031 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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