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BFR540,235

NXP Semiconductors

BFR540,235 by NXP Semiconductors

BFR540,235 by NXP Semiconductors is an NPN transistor designed for surface mount applications. It features a max power dissipation of 0.5W, a min DC current gain (hFE) of 60, and operates up to 150 °C. Ideal for amplifying signals in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,089 parts In-Stock

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5,089

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Digiode

USA . 3,828 parts In-Stock

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3,828

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Anansix

USA . 953 parts In-Stock

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953

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Bristol Electronics

USA . 158 parts In-Stock

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158

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Native Components

USA . 819 parts In-Stock

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$0.430

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$0.413

819

$0.430

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$0.413

Northwest PG Solutions

USA . 393 parts In-Stock

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$0.473

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$0.417

393

$0.473

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$0.417

AZTECH Wire

Italy . 624 parts In-Stock

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$14.060

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624

$14.060

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One Stop Electronics

USA . 1,018 parts In-Stock

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$54.050

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1,018

$54.050

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Component Stockers USA

USA . 720 parts In-Stock

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$99.990

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720

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Corphita

USA . 3,247 parts In-Stock

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UNI Independent Distributors

Spain . 2,801 parts In-Stock

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Overview

Unlock superior performance with the BFR540,235 NPN transistor from NXP Semiconductors. Renowned for its quality and reliability, this surface mount device excels in diverse applications, ensuring stellar power management and efficiency. With a robust design capable of withstanding high temperatures, it delivers exceptional value, enhancing your electronic projects with seamless integration and reliable operation. Choose BFR540,235 for innovation you can trust!

Feature Benefit Bullets

Polarity or Channel Type: NPN

NPN transistors are versatile and widely used in various electronic applications, making this product suitable for a range of designs.

Configuration: SINGLE

A single configuration allows for simplicity in circuit design, making this transistor ideal for straightforward applications.

Surface Mount: YES

Surface mount design offers benefits such as reduced space requirements on PCBs and ease of automated assembly, enhancing manufacturing efficiency.

Maximum Power Dissipation (Abs): 0.5 W

With a power dissipation rating of 0.5 W, this transistor can handle significant power without overheating, ensuring reliable performance in various applications.

Minimum DC Current Gain (hFE): 60

A minimum DC current gain of 60 indicates good amplification capabilities, making this transistor efficient for signal amplification tasks.

Maximum Operating Temperature: 150 °C

Operating at temperatures up to 150 °C ensures the transistor can function in high-temperature environments, widening its range of applications.

Maximum Collector Current (IC): 0.12 A

With a maximum collector current of 0.12 A, this transistor is capable of handling moderate loads, suitable for various electronic circuits.

Terminal Finish: TIN

TIN terminal finish provides good solderability and corrosion resistance, ensuring durability and reliability over time in assembled products.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand up to 30 seconds at peak reflow temperature improves compatibility with modern assembly processes and reduces the risk of damage during soldering.

Peak Reflow Temperature °C: 260 °C

A peak reflow temperature of 260 °C means this transistor can endure the rigors of high-temperature soldering processes, making it suitable for a variety of PCB assembly methods.

Technical Specifications

Other Function Transistors BFR540,235 attributes and parameters. Explore more Other Function Transistors devices from NXP Semiconductors

Specs

Maximum Collector Current (IC):

Configuration:

Minimum DC Current Gain (hFE):

60

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BFR540,235 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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