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AFSC5G37E38T2

NXP Semiconductors

AFSC5G37E38T2 by NXP Semiconductors

NARROW BAND HIGH POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 26; Package Body Material: PLASTIC/EPOXY; Technology: LDMOS; No. of Functions: 1;

Median Price

$30.540

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

$23.300

100+ parts

$18.200

1k+ parts

-

10k+ parts

-

2,000

$23.300

$18.200

-

-

Richardson RFPD

USA . 1,785 parts In-Stock

1+ parts

$29.350

100+ parts

$26.420

1k+ parts

-

10k+ parts

-

1,785

$29.350

$26.420

-

-

Rochester

USA . 1,992 parts In-Stock

1+ parts

-

100+ parts

$31.730

1k+ parts

$28.390

10k+ parts

$26.720

1,992

-

$31.730

$28.390

$26.720

DigiKey

USA . 1,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,992

-

-

-

-

Verical

USA . 1,992 parts In-Stock

1+ parts

-

100+ parts

$39.663

1k+ parts

$35.487

10k+ parts

$33.400

1,992

-

$39.663

$35.487

$33.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,815 parts In-Stock

1+ parts

$23.750

100+ parts

-

1k+ parts

-

10k+ parts

-

1,815

$23.750

-

-

-

Vyrian

USA . 582 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

-

10k+ parts

-

582

$25.000

-

-

-

Flip Electronics

USA . 5,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,795

-

-

-

-

DigiKey Marketplace

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

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Anansix

USA . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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116

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 395 parts In-Stock

1+ parts

$0.836

100+ parts

-

1k+ parts

-

10k+ parts

-

395

$0.836

-

-

-

Northwest PG Solutions

USA . 795 parts In-Stock

1+ parts

$0.919

100+ parts

-

1k+ parts

-

10k+ parts

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795

$0.919

-

-

-

Corphita

USA . 3,787 parts In-Stock

1+ parts

$22.500

100+ parts

-

1k+ parts

-

10k+ parts

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3,787

$22.500

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-

-

UNI Independent Distributors

Spain . 302 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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302

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-

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-

Technical Specifications

RF & Microwave Amplifiers AFSC5G37E38T2 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

25.4 dB

JESD-609 Code:

e4

Mounting Feature:

No. of Functions:

1

No. of Terminals:

26

Maximum Operating Frequency:

3800 MHz

Minimum Operating Frequency:

3600 MHz

Maximum Operating Temperature:

125 Cel

Package Body Material:

Package Equivalence Code:

LCC26,.24X.4,20

Power Supplies (V):

29

RF or Microwave Device Type:

Technology:

Terminal Finish:

NICKEL PALLADIUM GOLD

Trade Compliance

AFSC5G37E38T2 RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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