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AFSC5G40E38T2

NXP Semiconductors

AFSC5G40E38T2 by NXP Semiconductors

NARROW BAND HIGH POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 26; Package Body Material: PLASTIC/EPOXY; Technology: LDMOS; Power Supplies (V): 28;

Median Price

$188.090

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 122 parts In-Stock

1+ parts

$30.400

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-

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122

$30.400

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Chip1Stop

Japan . 122 parts In-Stock

1+ parts

$345.780

100+ parts

$270.070

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122

$345.780

$270.070

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,387 parts In-Stock

1+ parts

$28.880

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-

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2,387

$28.880

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Vyrian

USA . 2,550 parts In-Stock

1+ parts

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2,550

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Flip Electronics

USA . 1,403 parts In-Stock

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1,403

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EPE Components Inc.

USA . 910 parts In-Stock

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910

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Bristol Electronics

USA . 535 parts In-Stock

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535

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Anansix

USA . 297 parts In-Stock

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297

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 455 parts In-Stock

1+ parts

$0.696

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-

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455

$0.696

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Northwest PG Solutions

USA . 1,458 parts In-Stock

1+ parts

$0.766

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1,458

$0.766

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AZTECH Wire

Italy . 440 parts In-Stock

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$14.120

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440

$14.120

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Corphita

USA . 1,630 parts In-Stock

1+ parts

$27.360

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1,630

$27.360

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UNI Independent Distributors

Spain . 5,536 parts In-Stock

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5,536

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Technical Specifications

RF & Microwave Amplifiers AFSC5G40E38T2 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

27.1 dB

Mounting Feature:

No. of Functions:

1

No. of Terminals:

26

Maximum Operating Frequency:

4000 MHz

Minimum Operating Frequency:

3700 MHz

Maximum Operating Temperature:

125 Cel

Package Body Material:

Package Equivalence Code:

LCC26,.24X.4,40

Power Supplies (V):

28

RF or Microwave Device Type:

Technology:

Trade Compliance

AFSC5G40E38T2 RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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