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74LVTH32245EC,557

NXP Semiconductors

74LVTH32245EC,557 by NXP Semiconductors

BUS TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,198 parts In-Stock

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8,198

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Digiode

USA . 3,465 parts In-Stock

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3,465

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Anansix

USA . 1,646 parts In-Stock

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1,646

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,151 parts In-Stock

1+ parts

$2.515

100+ parts

-

1k+ parts

$2.414

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$2.414

5,151

$2.515

-

$2.414

$2.414

Microchip USA

USA . 211 parts In-Stock

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$3.276

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211

$3.276

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One Stop Electronics

USA . 788 parts In-Stock

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$14.000

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788

$14.000

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Native Components

USA . 692 parts In-Stock

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$15.540

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692

$15.540

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Northwest PG Solutions

USA . 274 parts In-Stock

1+ parts

$17.094

100+ parts

$15.385

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274

$17.094

$15.385

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AZTECH Wire

Italy . 222 parts In-Stock

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$21.960

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222

$21.960

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QUARKTWIN TECHNOLOGY LTD

USA . 26,102 parts In-Stock

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UNI Independent Distributors

Spain . 5,678 parts In-Stock

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Corphita

USA . 2,820 parts In-Stock

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Technical Specifications

Bus Driver & Transceivers 74LVTH32245EC,557 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

4

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.3 ns

Propagation Delay (tpd):

3.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.5 mm

Trade Compliance

74LVTH32245EC,557 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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