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74LVT574PW,118

NXP Semiconductors

74LVT574PW,118 by NXP Semiconductors

NXP Semiconductors' 74LVT574PW,118 is an 8-bit bus driver with a propagation delay of 5.9 ns at 3.3V supply voltage. It features a small outline package, operates in industrial temperature range (-40 to 85°C), and supports a max frequency of 150MHz. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

$0.420

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,085 parts In-Stock

1+ parts

-

100+ parts

$0.412

1k+ parts

$0.342

10k+ parts

$0.305

13,085

-

$0.412

$0.342

$0.305

Verical

USA . 5,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.428

10k+ parts

$0.381

5,883

-

-

$0.428

$0.381

Distributors (In-Stock)

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Digiode

USA . 3,438 parts In-Stock

1+ parts

$0.164

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3,438

$0.164

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Vyrian

USA . 5,422 parts In-Stock

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5,422

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Goldney Electronics S.L.

Spain . 2,500 parts In-Stock

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2,500

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Legend Electronics Inc.

USA . 2,500 parts In-Stock

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2,500

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Anansix

USA . 1,165 parts In-Stock

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1,165

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Inventory MP

USA . 16 parts In-Stock

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16

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Bristol Electronics

USA . 16 parts In-Stock

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16

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Prism Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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Corphita

USA . 3,874 parts In-Stock

1+ parts

$0.156

100+ parts

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3,874

$0.156

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Native Components

USA . 468 parts In-Stock

1+ parts

$0.942

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468

$0.942

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Northwest PG Solutions

USA . 1,285 parts In-Stock

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$1.036

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1,285

$1.036

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Andel Nordic

Denmark . 3,238 parts In-Stock

1+ parts

$3.912

100+ parts

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$3.756

10k+ parts

$3.756

3,238

$3.912

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$3.756

$3.756

Microchip USA

USA . 416 parts In-Stock

1+ parts

$11.140

100+ parts

$11.140

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$11.140

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$11.140

416

$11.140

$11.140

$11.140

$11.140

AZTECH Wire

Italy . 741 parts In-Stock

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$20.240

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741

$20.240

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Continental Prestige Electronics

USA . 14,703 parts In-Stock

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$0.208

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14,703

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UNI Independent Distributors

Spain . 4,002 parts In-Stock

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Perfect Parts

USA . 2,135 parts In-Stock

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2,135

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Overview

Elevate your electronic designs with the 74LVT574PW,118 by NXP Semiconductors! As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability. This bus driver & transceiver is perfect for a wide range of applications. With fast propagation delay and 3-state output characteristics, this product ensures efficient performance. The compact package design and industrial-grade temperature make it versatile for various projects. Trust NXP Semiconductors to bring value and innovation to your electronic solutions!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 5.9 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount package allows for easy and convenient installation on printed circuit boards, saving space and reducing assembly time.

No. of Bits: 8

8-bit data transmission capability provides sufficient flexibility and precision for various communication protocols and interfaces.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows this product to function reliably in harsh industrial environments, ensuring durability and long-term performance.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption, making this product an efficient choice for bus driver applications.

Technical Specifications

Bus Driver & Transceivers 74LVT574PW,118 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

BROADSIDE VERSION OF 374

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

12 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74LVT574PW,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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