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74LVT574BQ,115

NXP Semiconductors

74LVT574BQ,115 by NXP Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: RECTANGULAR;

Median Price

$1.160

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$1.160

1k+ parts

$0.963

10k+ parts

$0.858

147

-

$1.160

$0.963

$0.858

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,109 parts In-Stock

1+ parts

$0.463

100+ parts

-

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-

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-

1,109

$0.463

-

-

-

Bristol Electronics

USA . 2,494 parts In-Stock

1+ parts

-

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2,494

-

-

-

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Atlantic Semiconductor

USA . 2,494 parts In-Stock

1+ parts

-

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2,494

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-

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Vyrian

USA . 2,385 parts In-Stock

1+ parts

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2,385

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Anansix

USA . 742 parts In-Stock

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742

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 789 parts In-Stock

1+ parts

$0.438

100+ parts

-

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-

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789

$0.438

-

-

-

Andel Nordic

Denmark . 2,951 parts In-Stock

1+ parts

$3.192

100+ parts

-

1k+ parts

$3.064

10k+ parts

$3.064

2,951

$3.192

-

$3.064

$3.064

Native Components

USA . 572 parts In-Stock

1+ parts

$5.360

100+ parts

-

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572

$5.360

-

-

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AZTECH Wire

Italy . 1,204 parts In-Stock

1+ parts

$11.880

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-

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1,204

$11.880

-

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Corohmni

South Africa . 187 parts In-Stock

1+ parts

$14.386

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187

$14.386

-

-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$23.390

100+ parts

$21.285

1k+ parts

$19.180

10k+ parts

-

2,500

$23.390

$21.285

$19.180

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QUARKTWIN TECHNOLOGY LTD

USA . 14,059 parts In-Stock

1+ parts

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14,059

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Microchip USA

USA . 5,136 parts In-Stock

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5,136

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UNI Independent Distributors

Spain . 513 parts In-Stock

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513

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Northwest PG Solutions

USA . 218 parts In-Stock

1+ parts

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100+ parts

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$5.253

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218

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$5.253

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Technical Specifications

Bus Driver & Transceivers 74LVT574BQ,115 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

LVT

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.1X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2.5 mm

Trade Compliance

74LVT574BQ,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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