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74LVT32DB,118

NXP Semiconductors

74LVT32DB,118 by NXP Semiconductors

NXP Semiconductors' 74LVT32DB,118 is a BICMOS logic gate with 4 functions and 2 inputs. It operates at a supply voltage of 3.3V, has a propagation delay of 4.6ns, and can handle a max power supply current of 2mA. Ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

$0.892

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 670 parts In-Stock

1+ parts

-

100+ parts

$0.876

1k+ parts

$0.727

10k+ parts

$0.648

670

-

$0.876

$0.727

$0.648

Verical

USA . 670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.909

10k+ parts

$0.810

670

-

-

$0.909

$0.810

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,270 parts In-Stock

1+ parts

$0.350

100+ parts

-

1k+ parts

-

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-

1,270

$0.350

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-

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Vyrian

USA . 3,113 parts In-Stock

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-

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3,113

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Anansix

USA . 2,372 parts In-Stock

1+ parts

-

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2,372

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,654 parts In-Stock

1+ parts

$0.331

100+ parts

-

1k+ parts

-

10k+ parts

-

4,654

$0.331

-

-

-

Component Stockers USA

USA . 1,585 parts In-Stock

1+ parts

$0.380

100+ parts

$0.360

1k+ parts

$0.320

10k+ parts

-

1,585

$0.380

$0.360

$0.320

-

Microchip USA

USA . 150 parts In-Stock

1+ parts

$6.140

100+ parts

$6.140

1k+ parts

$6.140

10k+ parts

$6.140

150

$6.140

$6.140

$6.140

$6.140

AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$17.640

100+ parts

-

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-

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-

204

$17.640

-

-

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Native Components

USA . 238 parts In-Stock

1+ parts

$20.707

100+ parts

-

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238

$20.707

-

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Northwest PG Solutions

USA . 404 parts In-Stock

1+ parts

$22.778

100+ parts

$20.500

1k+ parts

-

10k+ parts

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404

$22.778

$20.500

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QUARKTWIN TECHNOLOGY LTD

USA . 18,678 parts In-Stock

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18,678

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UNI Independent Distributors

Spain . 2,849 parts In-Stock

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2,849

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Overview

Unleash the power of cutting-edge technology with the 74LVT32DB,118 by NXP Semiconductors. Crafted with precision and expertise, this logic gate offers unparalleled performance and reliability for a wide range of applications. Whether you're in the industrial sector or seeking to enhance your electronic projects, this product delivers exceptional value with its fast propagation delay and low power consumption. Elevate your designs with the quality and innovation that only NXP Semiconductors can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 4.6 ns

Low propagation delay ensures fast operation and response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and simplifying the overall design.

No. of Functions: 4

Having multiple functions in one device can reduce the overall component count in a circuit, leading to cost savings and simplified design.

Nominal Supply Voltage / Vsup (V): 3.3

Compatibility with a commonly used nominal supply voltage of 3.3V makes integration into existing systems convenient and practical.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance in a variety of environmental conditions, making this product versatile.

Technical Specifications

Logic Gates 74LVT32DB,118 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

2 mA

Propagation Delay At Nominal Supply:

4.6 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74LVT32DB,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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