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74LVCH322245AEC;55

NXP Semiconductors

74LVCH322245AEC;55 by NXP Semiconductors

BUS TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: LFBGA; Package Shape: RECTANGULAR;

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 1,876 parts In-Stock

1+ parts

$5.000

100+ parts

-

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1,876

$5.000

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DF Sales Co.

USA . 1,876 parts In-Stock

1+ parts

$5.000

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1,876

$5.000

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Chip Stock

USA . 50,000 parts In-Stock

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50,000

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Vyrian

USA . 5,943 parts In-Stock

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5,943

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Digiode

USA . 926 parts In-Stock

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926

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Anansix

USA . 365 parts In-Stock

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365

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Prism Electronics

USA . 61 parts In-Stock

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61

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 11 parts In-Stock

1+ parts

$2.547

100+ parts

-

1k+ parts

$2.445

10k+ parts

$2.445

11

$2.547

-

$2.445

$2.445

Microchip USA

USA . 671 parts In-Stock

1+ parts

$8.633

100+ parts

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671

$8.633

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AZTECH Wire

Italy . 1,066 parts In-Stock

1+ parts

$12.180

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1,066

$12.180

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One Stop Electronics

USA . 519 parts In-Stock

1+ parts

$27.000

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519

$27.000

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UNI Independent Distributors

Spain . 3,489 parts In-Stock

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3,489

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,975 parts In-Stock

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1,975

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Northwest PG Solutions

USA . 1,322 parts In-Stock

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1,322

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Native Components

USA . 928 parts In-Stock

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928

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Perfect Parts

USA . 60 parts In-Stock

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60

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Technical Specifications

Bus Driver & Transceivers 74LVCH322245AEC;55 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e0

Length:

13.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.7 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

5.5 mm

Trade Compliance

74LVCH322245AEC;55 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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