Loading...

74LVCH16245ABQ,518

NXP Semiconductors

74LVCH16245ABQ,518 by NXP Semiconductors

74LVCH16245ABQ,518 from NXP is a CMOS bus driver with an 8-bit capacity and a propagation delay of just 6 ns. It operates at a nominal voltage of 3.3V and supports bidirectional data flow. Ideal for automotive applications, it features robust temperature ratings from -40 °C to 125 °C.

Median Price

$1.448

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

$1.180

10k+ parts

$1.050

10,000

-

$1.420

$1.180

$1.050

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.475

10k+ parts

$1.313

10,000

-

-

$1.475

$1.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,758 parts In-Stock

1+ parts

$0.566

100+ parts

-

1k+ parts

-

10k+ parts

-

1,758

$0.566

-

-

-

Vyrian

USA . 3,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,653

-

-

-

-

Anansix

USA . 1,581 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,581

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,366 parts In-Stock

1+ parts

$0.536

100+ parts

-

1k+ parts

-

10k+ parts

-

3,366

$0.536

-

-

-

Andel Nordic

Denmark . 204 parts In-Stock

1+ parts

$3.275

100+ parts

-

1k+ parts

$3.144

10k+ parts

$3.144

204

$3.275

-

$3.144

$3.144

AZTECH Wire

Italy . 1,075 parts In-Stock

1+ parts

$14.990

100+ parts

-

1k+ parts

-

10k+ parts

-

1,075

$14.990

-

-

-

Microchip USA

USA . 376 parts In-Stock

1+ parts

$17.561

100+ parts

-

1k+ parts

-

10k+ parts

-

376

$17.561

-

-

-

Corohmni

South Africa . 186 parts In-Stock

1+ parts

$21.992

100+ parts

-

1k+ parts

-

10k+ parts

-

186

$21.992

-

-

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$32.304

100+ parts

$29.397

1k+ parts

$26.489

10k+ parts

-

600

$32.304

$29.397

$26.489

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

UNI Independent Distributors

Spain . 6,978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,978

-

-

-

-

Native Components

USA . 640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

640

-

-

-

-

Northwest PG Solutions

USA . 523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

523

-

-

-

-

Overview

Elevate your designs with the 74LVCH16245ABQ from NXP Semiconductors, a premium bus driver and transceiver that ensures seamless data transmission in demanding applications. With its robust performance, low propagation delay, and wide operating temperature range, this device enhances efficiency and reliability in automotive and industrial settings. Trust in NXP's legacy of innovation to deliver unmatched quality, empowering your projects with speed and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 6 ns

A low propagation delay enables fast signal transmission, improving overall system performance and responsiveness.

Surface Mount: YES

Surface mount technology allows for smaller circuit designs and easier assembly, making it ideal for compact devices.

No. of Functions: 2

Offering multiple functions in a single package provides flexibility in design and space-saving benefits.

No. of Bits: 8

An 8-bit architecture allows for efficient data processing and communication, suitable for a variety of digital applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V makes it compatible with a wide range of modern digital circuits.

Load Capacitance (CL): 50 pF

A relatively low load capacitance ensures better driveability and improved signal integrity in high-speed applications.

Power Supplies (V): 3.3

Utilizing a single power supply voltage simplifies power management in systems, reducing component count and complexity.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is beneficial for thermal management and reliability in automotive applications.

Maximum I (ol): 24 Amp

A maximum output current of 24A supports high-power applications, making it versatile for various demanding tasks.

Maximum Operating Temperature: 125 °C

High-temperature tolerance ensures reliable operation in extreme environments, suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in bus communication, allowing for efficient data sharing among multiple devices.

Minimum Operating Temperature: -40 °C

A wide operating temperature range ensures performance in harsh conditions, particularly in automotive environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances reliability and resistance to corrosion, ensuring long-term stability and performance of connections.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of signals and can facilitate more straightforward PCB layouts.

Output Polarity: TRUE

True output polarity ensures consistent and predictable performance in various electronic circuit designs.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum of 30 seconds at peak reflow temperature minimizes risk of damage during soldering processes.

Peak Reflow Temperature °C: 260

High reflow temperature capability enhances adhesion and reliability of solder joints in surface mount applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this temperature grade ensures reliability in vehicle environments.

Technology: CMOS

Using CMOS technology allows for low power consumption and high speed, optimizing performance in digital circuits.

Terminal Form: NO LEAD

No lead form provides a smaller footprint on PCBs, which is advantageous for space-constrained applications.

Packing Method: TR

Tape and reel packaging facilitates automated assembly processes, improving manufacturing efficiency.

Count Direction: BIDIRECTIONAL

Bidirectional capability allows for flexible data flow direction, accommodating various communication protocols.

Control Type: COMMON CONTROL

Common control simplifies the integration into existing circuit designs, providing ease of use and flexibility.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, the product is moderately sensitive to moisture, allowing for reasonable handling during assembly.

Technical Specifications

Bus Driver & Transceivers 74LVCH16245ABQ,518 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

74LVCH16245ABQ,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20