Loading...

74LVC623APW-Q100J

NXP Semiconductors

74LVC623APW-Q100J by NXP Semiconductors

74LVC623APW-Q100J by NXP is an 8-bit bus driver with a propagation delay of just 6.5 ns, ideal for automotive applications. It operates at a nominal voltage of 3.3V and supports bidirectional data flow. Designed for high reliability, it withstands temperatures from -40 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,210

-

-

-

-

Anansix

USA . 2,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,297

-

-

-

-

Vyrian

USA . 2,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,129

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,296 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,296

$6.000

-

-

-

Andel Nordic

Denmark . 5,691 parts In-Stock

1+ parts

$8.509

100+ parts

-

1k+ parts

$8.169

10k+ parts

$8.169

5,691

$8.509

-

$8.169

$8.169

AZTECH Wire

Italy . 1,060 parts In-Stock

1+ parts

$20.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

$20.280

-

-

-

Microchip USA

USA . 343 parts In-Stock

1+ parts

$41.152

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$41.152

-

-

-

UNI Independent Distributors

Spain . 6,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,141

-

-

-

-

Corphita

USA . 4,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,946

-

-

-

-

Northwest PG Solutions

USA . 942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

942

-

-

-

-

Native Components

USA . 489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

489

-

-

-

-

Overview

Unlock superior performance and reliability with the 74LVC623APW-Q100J from NXP Semiconductors. Designed for demanding automotive applications, this advanced bus driver ensures seamless data transmission with minimal delay. With robust quality assurance under AEC-Q100 standards, customers benefit from enhanced efficiency and longevity across various systems. Choose NXP for unmatched expertise and innovation—drive your projects forward with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability, making it suitable for automotive applications.

Propagation Delay At Nominal Supply: 6.5 ns

A low propagation delay ensures fast signal transmission, enhancing overall performance in high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, ideal for modern electronic applications.

Screening Level: AEC-Q100

Meeting the AEC-Q100 standard ensures the product is qualified for automotive applications, enhancing reliability in harsh environments.

Package Shape: RECTANGULAR

The rectangular package shape is versatile for various PCB layouts, facilitating easy integration into different design environments.

No. of Bits: 8

An 8-bit architecture allows for efficient data handling and increased parallel processing capabilities.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V makes it compatible with a wide range of low-voltage systems, promoting energy efficiency.

Power Supplies (V): 3.3

Supports a single 3.3V supply, simplifying power management in designs.

No. of Terminals: 20

With 20 terminals, it offers extensive connectivity options, meeting various application requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design optimize space on the PCB, making it advantageous for compact devices.

Maximum I (ol): 24 Amp

A high output current capability supports demanding applications, ensuring robust performance in power-intensive scenarios.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures ensures reliability in extreme environments, crucial for automotive applications.

Output Characteristics: 3-STATE

3-state output characteristics allow for greater flexibility in bus-driven applications, facilitating better signal management.

Minimum Operating Temperature: -40 °C

Operating in low temperature ranges enhances reliability in cold environments, an essential feature for automotive electronic systems.

Terminal Position: DUAL

Dual terminal positions aid in easier routing on PCBs, offering design flexibility.

Output Polarity: TRUE

TRUE output polarity ensures consistent performance characteristics, making it suitable for standard digital applications.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, guaranteeing quality and reliability in automotive systems.

Technology: CMOS

CMOS technology provides lower power consumption and better noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal forms facilitate easy soldering and provide strong mechanical connections, enhancing assembly reliability.

Packing Method: TR

Tape and reel packaging allows for automated production processes, reducing assembly time and improving efficiency.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm helps accommodate high-density PCB layouts, promoting design flexibility.

Count Direction: BIDIRECTIONAL

Bidirectional counting capabilities enhance the functionality of the device in various applications.

Control Type: INDEPENDENT CONTROL

Independent control allows for versatile operation modes, ensuring adaptability in multi-device systems.

Technical Specifications

Bus Driver & Transceivers 74LVC623APW-Q100J attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-PDSO-G20

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

74LVC623APW-Q100J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20