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74LVC1G332GV-Q100,125

NXP Semiconductors

74LVC1G332GV-Q100,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1G332GV-Q100,125 is a CMOS Logic Gate with 3 inputs and 21.5 ns propagation delay. AEC-Q100 screened for automotive applications, it operates b/w -40 to 125 °C with supply voltage range of 1.65V to 5.5V in a small outline package suitable for surface mount assembly.

Median Price

$0.070

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 159,000 parts In-Stock

1+ parts

$0.070

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$0.070

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$0.070

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159,000

$0.070

$0.070

$0.070

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$0.078

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100

$0.078

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Digiode

USA . 2,910 parts In-Stock

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$0.081

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2,910

$0.081

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DigiKey Marketplace

USA . 111,000 parts In-Stock

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Vyrian

USA . 2,621 parts In-Stock

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Anansix

USA . 238 parts In-Stock

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238

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VNN

France . 100 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 110,964 parts In-Stock

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$0.072

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Corphita

USA . 1,226 parts In-Stock

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$0.076

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Netroflash

USA . 2,000 parts In-Stock

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$0.078

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$0.074

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$0.072

2,000

$0.078

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$0.074

$0.072

Microchip USA

USA . 2,842 parts In-Stock

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$0.520

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2,842

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AZTECH Wire

Italy . 80 parts In-Stock

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$22.090

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UNI Independent Distributors

Spain . 5,198 parts In-Stock

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Overview

Discover the cutting-edge 74LVC1G332GV-Q100,125 by NXP Semiconductors. This high-quality logic gate delivers top-notch performance and reliability for a wide range of automotive applications. With its advanced technology and AEC-Q100 screening level, this compact component ensures optimal functionality and efficiency. Trust NXP Semiconductors to provide you with the best solutions for all your automotive electronics needs. Upgrade your designs with the 74LVC1G332GV-Q100,125 and experience unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability to the product and ensures it can withstand harsh environmental conditions.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving space and reducing assembly time.

Screening Level: AEC-Q100

Ensures high quality and reliability, making it suitable for automotive applications where stringent requirements are needed.

Nominal Supply Voltage (Vsup): 1.8V

Low power consumption and compatibility with a wide range of systems.

Propagation Delay (tpd): 21.5 ns

Fast response time contributes to efficient operation and performance.

Maximum Operating Temperature: 125°C

Ensures the product can operate in high-temperature environments without degradation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates 74LVC1G332GV-Q100,125 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

Logic IC Type:

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Propagation Delay (tpd):

21.5 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.5 mm

Trade Compliance

74LVC1G332GV-Q100,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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