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74LVC1G08GS,132

NXP Semiconductors

74LVC1G08GS,132 by NXP Semiconductors

74LVC1G08GS,132 from NXP Semiconductors is a CMOS logic gate with a propagation delay of just 6 ns and operates within a supply voltage range of 1.65V to 5.5V. Its compact design features a thin profile and dual terminal position, making it ideal for automotive applications. With a max operating temperature of 125 °C, it ensures reliability in demanding environments.

Median Price

$0.184

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 5,611 parts In-Stock

1+ parts

$0.200

100+ parts

$0.099

1k+ parts

$0.082

10k+ parts

$0.073

5,611

$0.200

$0.099

$0.082

$0.073

Mouser Electronics

USA . 5,448 parts In-Stock

1+ parts

$0.200

100+ parts

$0.092

1k+ parts

$0.083

10k+ parts

$0.071

5,448

$0.200

$0.092

$0.083

$0.071

Rochester

USA . 635,000 parts In-Stock

1+ parts

-

100+ parts

$0.167

1k+ parts

$0.139

10k+ parts

$0.124

635,000

-

$0.167

$0.139

$0.124

Verical

USA . 615,000 parts In-Stock

1+ parts

-

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$0.155

615,000

-

-

-

$0.155

Distributors (In-Stock)

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Digiode

USA . 4,126 parts In-Stock

1+ parts

$0.060

100+ parts

-

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4,126

$0.060

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Chip Stock

USA . 165,000 parts In-Stock

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165,000

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DigiKey Marketplace

USA . 53,258 parts In-Stock

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53,258

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NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

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$0.099

10,000

-

-

-

$0.099

Vyrian

USA . 6,841 parts In-Stock

1+ parts

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6,841

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Anansix

USA . 1,602 parts In-Stock

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1,602

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Bristol Electronics

USA . 125 parts In-Stock

1+ parts

-

100+ parts

$0.188

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125

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$0.188

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Distributors (Availability)

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Corphita

USA . 529 parts In-Stock

1+ parts

$0.057

100+ parts

-

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529

$0.057

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AZTECH Wire

Italy . 7,779 parts In-Stock

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$0.220

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7,779

$0.220

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Microchip USA

USA . 3,865 parts In-Stock

1+ parts

$0.645

100+ parts

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3,865

$0.645

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$10.123

100+ parts

$9.212

1k+ parts

$8.301

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10

$10.123

$9.212

$8.301

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Corohmni

South Africa . 265 parts In-Stock

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$29.323

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265

$29.323

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UNI Independent Distributors

Spain . 4,014 parts In-Stock

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Northwest PG Solutions

USA . 1,390 parts In-Stock

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Native Components

USA . 1,320 parts In-Stock

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Supply Digital

USA . 584 parts In-Stock

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Overview

Unlock the potential of your designs with the 74LVC1G08GS,132 from NXP Semiconductors—a leader in high-quality logic gate solutions. This compact and efficient device ensures rapid signal processing with minimal power consumption, making it perfect for applications in automotive, consumer electronics, and industrial automation. Experience reliability and performance that elevate your projects, backed by NXP's commitment to innovation and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a robust and durable package, ensuring reliability for automotive applications.

Propagation Delay At Nominal Supply: 6 ns

A low propagation delay enhances the speed of the logic gate, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and effective utilization of PCB space.

No. of Inputs: 2

Having two inputs allows for versatile logic operations, making it adaptable for various logical circuits.

Package Shape: SQUARE

The square package shape is efficient for layout and can improve thermal performance when mounted.

Nominal Supply Voltage / Vsup: 1.8 V

Operating at a low nominal supply voltage enhances power efficiency, ideal for battery-operated devices.

Load Capacitance (CL): 50 pF

A moderate load capacitance helps maintain signal integrity while minimizing power consumption.

Power Supplies (V): 3.3 V

Compatible with common power supply levels, making it easy to integrate into existing systems.

No. of Terminals: 6

Six terminals enable a variety of interconnections, enhancing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

A small outline and thin profile allow for dense packing on circuit boards, optimizing space.

Maximum I (ol): 24 Amp

High output current capability allows it to drive heavier loads, expanding its usability in various applications.

Propagation Delay (tpd): 10.5 ns

This delay is competitive, offering performance for applications that require quick response times.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes it suitable for use in harsh environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme conditions often encountered in automotive settings.

Terminal Finish: TIN

Tin finish provides excellent solderability, ensuring reliable connections during assembly.

Terminal Position: DUAL

Dual terminal position enhances design flexibility and layout options for PCB designers.

Maximum Seated Height: 0.35 mm

A low sitting height aids in achieving a compact design, important for space-constrained applications.

Width: 1 mm

Compact width contributes to efficient layout on PCBs and supports miniaturization trends in electronic design.

Minimum Supply Voltage (Vsup): 1.65 V

Allows operation under lower voltage conditions, increasing the product's applicability in diverse scenarios.

Maximum Time At Peak Reflow Temperature: 30 s

A longer duration at peak reflow temperature ensures reliable solder joints and longevity of the component.

Peak Reflow Temperature: 260 °C

Designed to endure high-temperature soldering processes, making it suitable for automated assembly.

Length: 1 mm

The short length aids in compact design, aligning with the trend for smaller and tighter electronic assemblies.

Temperature Grade: AUTOMOTIVE

Specifically rated for automotive applications, ensuring reliability and compliance in automotive electronics.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, suitable for various digital applications.

Terminal Form: NO LEAD

No lead design minimizes the footprint and is beneficial for high-density designs.

Packing Method: TR

Tape and reel packaging is convenient for automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.35 mm

A small terminal pitch allows for tighter packing of components on PCBs, which is critical for space-constrained applications.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle a range of supply voltages provides flexibility in designing various circuits.

Technical Specifications

Logic Gates 74LVC1G08GS,132 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.35 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74LVC1G08GS,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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