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74LV244N,112

NXP Semiconductors

74LV244N,112 by NXP Semiconductors

BUS DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$0.969

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$0.951

1k+ parts

$0.789

10k+ parts

$0.704

450

-

$0.951

$0.789

$0.704

Verical

USA . 395 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.987

10k+ parts

$0.880

395

-

-

$0.987

$0.880

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,634 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

-

4,634

$0.380

-

-

-

Vyrian

USA . 7,632 parts In-Stock

1+ parts

-

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-

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7,632

-

-

-

-

Anansix

USA . 832 parts In-Stock

1+ parts

-

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-

1k+ parts

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832

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 450 parts In-Stock

1+ parts

$0.340

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$0.340

-

-

-

Corphita

USA . 3,183 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

-

10k+ parts

-

3,183

$0.360

-

-

-

Andel Nordic

Denmark . 2,994 parts In-Stock

1+ parts

$2.859

100+ parts

-

1k+ parts

$2.745

10k+ parts

$2.745

2,994

$2.859

-

$2.745

$2.745

AZTECH Wire

Italy . 109 parts In-Stock

1+ parts

$13.300

100+ parts

-

1k+ parts

-

10k+ parts

-

109

$13.300

-

-

-

Microchip USA

USA . 297 parts In-Stock

1+ parts

$32.239

100+ parts

-

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-

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297

$32.239

-

-

-

Native Components

USA . 879 parts In-Stock

1+ parts

$37.717

100+ parts

-

1k+ parts

-

10k+ parts

$36.208

879

$37.717

-

-

$36.208

Northwest PG Solutions

USA . 1,302 parts In-Stock

1+ parts

$41.489

100+ parts

-

1k+ parts

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1,302

$41.489

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 24,825 parts In-Stock

1+ parts

-

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24,825

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UNI Independent Distributors

Spain . 1,132 parts In-Stock

1+ parts

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1,132

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-

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Perfect Parts

USA . 780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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780

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Technical Specifications

Bus Driver & Transceivers 74LV244N,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

TYPICAL VOLP < 0.8V AT VCC = 3.3V, TA = 25 DEGREE C

Control Type:

ENABLE LOW

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

26.73 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

31 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74LV244N,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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