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74LV241DB,112

NXP Semiconductors

74LV241DB,112 by NXP Semiconductors

NXP Semiconductors' 74LV241DB,112 is a CMOS bus driver with 2 functions and 4 bits. It operates at a nominal voltage of 3.3V, has a propagation delay of 21ns, and features a small outline package for surface mounting. Ideal for automotive applications due to its wide temperature range and true output polarity.

Median Price

$0.788

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,348 parts In-Stock

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$0.773

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$0.641

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$0.572

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$0.773

$0.641

$0.572

Verical

USA . 924 parts In-Stock

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$0.802

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$0.715

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$0.715

Distributors (In-Stock)

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Digiode

USA . 802 parts In-Stock

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$0.309

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Vyrian

USA . 2,157 parts In-Stock

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Anansix

USA . 1,036 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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Distributors (Availability)

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Corphita

USA . 2,080 parts In-Stock

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$0.292

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$0.292

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Component Stockers USA

USA . 3,765 parts In-Stock

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$0.340

100+ parts

$0.320

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$0.290

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Andel Nordic

Denmark . 5,553 parts In-Stock

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$4.447

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$4.269

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$4.269

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$4.447

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$4.269

Microchip USA

USA . 148 parts In-Stock

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$8.279

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AZTECH Wire

Italy . 641 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

USA . 1,348 parts In-Stock

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$0.390

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Native Components

USA . 992 parts In-Stock

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Northwest PG Solutions

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Overview

Enhance your electronic designs with the 74LV241DB,112 from NXP Semiconductors. This bus driver and transceiver are engineered with top-notch quality and reliability, making it a go-to choice for various applications. With its compact size and advanced technology, this product offers seamless performance, low power consumption, and fast data transmission. Trust NXP Semiconductors to deliver products that bring value and efficiency to your projects. Upgrade your designs with the 74LV241DB,112 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in automotive applications where weight and reliability are important factors.

Propagation Delay At Nominal Supply: 21 ns

The low propagation delay ensures fast data transmission, making this product suitable for high-speed communication systems.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having two functions in one component saves space on the circuit board and reduces the overall component count in the system.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor, making it compatible with a wide range of existing equipment and designs.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable operation and signal integrity in various operating conditions, making this product reliable in different environments.

Technology: CMOS

The use of CMOS technology in the design results in low power consumption and high noise immunity, making this product energy-efficient and reliable for long-term use.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with other components, enhancing the overall reliability of the system.

Technical Specifications

Bus Driver & Transceivers 74LV241DB,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

OUTPUT ENABLE ACTIVE HIGH FOR ONE FUNCTION

Control Type:

ENABLE LOW/HIGH

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

21 ns

Propagation Delay (tpd):

36 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74LV241DB,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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