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74ALVT162821DGG,11

NXP Semiconductors

74ALVT162821DGG,11 by NXP Semiconductors

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$3.920

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 875 parts In-Stock

1+ parts

$3.920

100+ parts

$3.690

1k+ parts

$3.340

10k+ parts

-

875

$3.920

$3.690

$3.340

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,833 parts In-Stock

1+ parts

$3.724

100+ parts

-

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4,833

$3.724

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Vyrian

USA . 4,464 parts In-Stock

1+ parts

-

100+ parts

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4,464

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Anansix

USA . 1,981 parts In-Stock

1+ parts

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1,981

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 716 parts In-Stock

1+ parts

$0.344

100+ parts

-

1k+ parts

-

10k+ parts

$0.330

716

$0.344

-

-

$0.330

Northwest PG Solutions

USA . 1,398 parts In-Stock

1+ parts

$0.378

100+ parts

-

1k+ parts

-

10k+ parts

$0.333

1,398

$0.378

-

-

$0.333

Andel Nordic

Denmark . 1,000 parts In-Stock

1+ parts

$2.770

100+ parts

-

1k+ parts

$1.937

10k+ parts

$1.937

1,000

$2.770

-

$1.937

$1.937

Ampacity Inc.

Singapore . 557 parts In-Stock

1+ parts

$3.330

100+ parts

-

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557

$3.330

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Corphita

USA . 389 parts In-Stock

1+ parts

$3.528

100+ parts

-

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389

$3.528

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Corohmni

South Africa . 351 parts In-Stock

1+ parts

$13.806

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-

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351

$13.806

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AZTECH Wire

Italy . 714 parts In-Stock

1+ parts

$19.520

100+ parts

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714

$19.520

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Microchip USA

USA . 1,489 parts In-Stock

1+ parts

$21.710

100+ parts

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1,489

$21.710

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UNI Independent Distributors

Spain . 5,872 parts In-Stock

1+ parts

-

100+ parts

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5,872

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iodParts Technologies Inc.

India . 4,000 parts In-Stock

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4,000

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Technical Specifications

Bus Driver & Transceivers 74ALVT162821DGG,11 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

USER SELECTABLE 3.3V VCC

Family:

ALVT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14.15 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

6.25 mm

Trade Compliance

74ALVT162821DGG,11 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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