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MSCSM120AM31CT1AG

Microchip Technology

MSCSM120AM31CT1AG by Microchip Technology

MSCSM120AM31CT1AG by Microchip Technology is a N-CHANNEL FET with 1200V DS breakdown voltage. It features series connected, center tap configuration for switching applications. With 180A max pulsed drain current and 395W power dissipation, it's ideal for high-power operations in various industries.

Median Price

$105.600

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7 parts In-Stock

1+ parts

$105.600

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7

$105.600

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Verical

USA . 10 parts In-Stock

1+ parts

$117.980

100+ parts

$105.320

1k+ parts

$105.320

10k+ parts

$105.320

10

$117.980

$105.320

$105.320

$105.320

Arrow

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$105.320

1k+ parts

$105.320

10k+ parts

$105.320

10

-

$105.320

$105.320

$105.320

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$123.715

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10

$123.715

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Vyrian

USA . 8,806 parts In-Stock

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8,806

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 731 parts In-Stock

1+ parts

$13.982

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731

$13.982

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Ampacity Inc.

Singapore . 9 parts In-Stock

1+ parts

$89.520

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9

$89.520

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$123.715

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$121.241

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2,000

$123.715

$121.241

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Continental Prestige Electronics

USA . 950 parts In-Stock

1+ parts

$123.715

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10k+ parts

$121.241

950

$123.715

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$121.241

Argo Parts USA

USA . 2,941 parts In-Stock

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2,941

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RGB Technical Solutions

Ukraine . 1,021 parts In-Stock

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1,021

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Overview

Enhance the performance of your power applications with the MSCSM120AM31CT1AG by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a minimum DS breakdown voltage of 1200V and maximum pulsing drain current of 180A, this N-channel FET offers incredible power dissipation and efficiency. Whether you're designing for industrial or automotive use, this series-connected transistor with built-in diode and thermistor provides unmatched reliability and performance. Upgrade your projects today with the MSCSM120AM31CT1AG and experience the difference Microchip Technology brings to your designs.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - Provides efficient switching capabilities for various applications.

Configuration:

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR - Offers flexibility and added functionality in circuit design.

Transistor Application:

SWITCHING - Ideal for controlling the flow of power in electronic devices.

Minimum DS Breakdown Voltage:

1200 V - Ensures reliable operation and protection against voltage spikes.

Package Shape:

RECTANGULAR - Allows for easy integration into circuit boards.

Operating Mode:

ENHANCEMENT MODE - Enables fast and efficient switching performance.

No. of Elements:

2 - Provides redundancy and improved reliability in circuit operation.

Maximum Pulsed Drain Current (IDM):

180 A - Handles high current loads without overheating.

Maximum Drain Current (Abs) (ID):

89 A - Maintains stable performance under normal operating conditions.

No. of Terminals:

12 - Allows for multiple connection options and configurations.

Maximum Power Dissipation (Abs):

395 W - Can handle high power levels without failure.

Package Style (Meter):

FLANGE MOUNT - Facilitates easy mounting and secure connection.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Provides high efficiency and reliability in power management.

Maximum Operating Temperature:

175 °C - Suitable for a wide range of operating environments.

Transistor Element Material:

SILICON CARBIDE - Offers superior performance and durability compared to traditional materials.

Minimum Operating Temperature:

40 °C - Ensures functionality in extreme cold conditions.

Maximum Drain-Source On Resistance:

0.031 ohm - Low resistance for efficient power flow and minimal heat generation.

Terminal Position:

UPPER - Simplifies installation and circuit layout.

Case Connection:

ISOLATED - Provides electrical insulation and prevents short circuits.

Technical Specifications

Power Field Effect Transistors (FET) MSCSM120AM31CT1AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Microchip Technology

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

89 A

Maximum Drain Current (ID):

89 A

Maximum Drain-Source On Resistance:

.031 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X12

No. of Elements:

2

No. of Terminals:

12

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

180 A

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

MSCSM120AM31CT1AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.50.00.80

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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