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ZL50023QCG1

Microchip Technology

ZL50023QCG1 by Microchip Technology

Microchip Technology's ZL50023QCG1 is a Telecom IC with 256 terminals, operating from -40 to 85°C. It features a low profile flatpack package with Gull Wing terminals and requires 130mA supply current at 1.8V. Ideal for digital time switching applications in the telecom industry.

Median Price

$81.444

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$81.444

100+ parts

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300

$81.444

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Vyrian

USA . 3,792 parts In-Stock

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3,792

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 240 parts In-Stock

1+ parts

$11.801

100+ parts

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240

$11.801

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Ampacity Inc.

Singapore . 24 parts In-Stock

1+ parts

$78.470

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24

$78.470

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Continental Prestige Electronics

USA . 2,802 parts In-Stock

1+ parts

$81.444

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1k+ parts

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10k+ parts

$79.815

2,802

$81.444

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$79.815

Netroflash

USA . 50 parts In-Stock

1+ parts

$81.444

100+ parts

-

1k+ parts

$77.371

10k+ parts

$75.743

50

$81.444

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$77.371

$75.743

Microchip USA

USA . 2,845 parts In-Stock

1+ parts

$197.734

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2,845

$197.734

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Lixinc

USA . 8,702 parts In-Stock

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8,702

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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RGB Technical Solutions

Ukraine . 2,025 parts In-Stock

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2,025

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Argo Parts USA

USA . 35 parts In-Stock

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35

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Overview

Upgrade your telecom systems with the ZL50023QCG1 by Microchip Technology, a cutting-edge digital time switch that guarantees top-notch performance and reliability. Manufactured by industry leader Microchip Technology, this Telecom - Switching IC offers unparalleled quality and precision. With its compact design and versatile applications, this product is perfect for a wide range of telecommunications uses. Trust in the excellence of Microchip Technology and experience the value and benefits that the ZL50023QCG1 can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability of the product, making it suitable for long-term use in telecom applications.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into PCBs, saving space and enhancing overall system design flexibility.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it ideal for applications where board real estate is limited.

No. of Terminals: 256

With a high number of terminals, this product offers a wide range of connectivity options, allowing for versatile and complex telecom network configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making it suitable for industrial telecom applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments, ensuring consistent performance in a variety of conditions.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection, making installation and maintenance of the product hassle-free.

Maximum Seated Height: 1.6 mm

The low maximum seated height of the package saves space on the PCB, allowing for compact and efficient system design.

Width: 28 mm

The moderate width of the package allows for easy integration into standard PCB layouts, simplifying the overall assembly process.

Length: 28 mm

The moderate length of the package ensures compatibility with standard PCB form factors, making it easy to incorporate into existing designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade of the product guarantees reliable operation in demanding environments, making it a suitable choice for telecom applications in harsh conditions.

Terminal Form: GULL WING

The gull wing terminal form offers secure and stable connections, reducing the risk of signal loss or interference in high-speed telecom applications.

Maximum Supply Current: 130 mA

The moderate maximum supply current requirement allows for efficient power management, ensuring low power consumption and optimal performance of the product.

Telecom IC Type: DIGITAL TIME SWITCH

As a digital time switch IC, this product offers advanced functionality and precise timing control, making it ideal for telecom applications that require accurate signal routing and switching.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources, making it a cost-effective choice for telecom systems.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for high-density packaging, enabling compact and space-efficient circuit designs for telecommunications infrastructure.

Technical Specifications

Telecom - Switching ICs ZL50023QCG1 attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G256

Length:

28 mm

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP256,1.2SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

130 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

ZL50023QCG1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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