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ZL50011/QCC

Microchip Technology

ZL50011/QCC by Microchip Technology

ZL50011/QCC by Microchip Technology is a Telecom IC with 160 terminals, operating at 3.3V. It features a low profile flatpack package with fine pitch, suitable for digital time switch applications in industrial temperature environments. With a max supply current of 250mA and Gull Wing terminal form, it offers reliable performance in telecom switching systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,207 parts In-Stock

1+ parts

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1,207

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 254 parts In-Stock

1+ parts

$11.734

100+ parts

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254

$11.734

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Ampacity Inc.

Singapore . 1,423 parts In-Stock

1+ parts

$803.000

100+ parts

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1,423

$803.000

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Argo Parts USA

USA . 4,211 parts In-Stock

1+ parts

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4,211

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Fulton Briggs Corp.

USA . 3,470 parts In-Stock

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3,470

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Continental Prestige Electronics

USA . 2,786 parts In-Stock

1+ parts

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2,786

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Enhance your telecom systems with the ZL50011/QCC by Microchip Technology. With a reputation for high-quality products, Microchip Technology brings you a reliable and innovative Telecom - Switching IC that offers unmatched value and performance. Ideal for digital time switching applications, this square-shaped, low profile IC boasts a wide temperature range, making it suitable for industrial use. Upgrade your systems today and experience the benefits of superior technology with the ZL50011/QCC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it a suitable choice for long-term use in telecom applications.

Surface Mount: YES

Allows for easy and efficient installation, saving time and effort during manufacturing processes.

Package Shape: SQUARE

Compact square shape helps in maximizing space utilization on circuit boards, ideal for crowded electronic devices.

Power Supplies (V): 3.3

Operates on a standard voltage supply, ensuring compatibility with existing systems and reducing the need for additional components.

No. of Terminals: 160

High terminal count allows for versatile connectivity options, making it suitable for complex telecom systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style facilitates efficient heat dissipation and signal integrity, enhancing overall performance.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for use in a wide range of environments.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity, ensuring strong and reliable connections for long-term use.

Terminal Position: QUAD

Quad terminal position facilitates secure connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 1.6 mm

Low profile design allows for compact integration into electronic devices, saving valuable space on circuit boards.

Width: 24 mm

Compact width facilitates easy placement on circuit boards, optimizing space utilization for efficient design layout.

Length: 24 mm

Square shape with a consistent length ensures uniformity in design layout and simplifies manufacturing processes.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, offering robust performance and reliability in demanding environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections for long-term use.

Maximum Supply Current: 250 mA

Can handle high supply currents, making it suitable for power-intensive telecom applications.

Telecom IC Type: DIGITAL TIME SWITCH

Specifically designed for digital time switching applications, offering precision timing control in telecom systems.

Nominal Supply Voltage: 3.3 V

Operates on a standard nominal voltage, ensuring compatibility with existing power supplies and reducing the need for additional components.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense connectivity options, enabling high-density integration in telecom circuitry.

Technical Specifications

Telecom - Switching ICs ZL50011/QCC attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G160

JESD-609 Code:

e0

Length:

24 mm

No. of Functions:

1

No. of Terminals:

160

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP160,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

250 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Trade Compliance

ZL50011/QCC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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