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ZL50020QCG1

Microchip Technology

ZL50020QCG1 by Microchip Technology

ZL50020QCG1 by Microchip Technology is a Telecom IC with 256 terminals, operating at -40 to 85°C. It has power supplies of 1.8V and 3.3V, drawing a max current of 120mA. This digital time switch in a square package is ideal for telecom switching applications.

Median Price

$53.190

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 108 parts In-Stock

1+ parts

$53.190

100+ parts

$46.538

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108

$53.190

$46.538

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$46.210

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50

$46.210

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Vyrian

USA . 5,890 parts In-Stock

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5,890

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Distributors (Availability)

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AZTECH Wire

Italy . 854 parts In-Stock

1+ parts

$7.603

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854

$7.603

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Continental Prestige Electronics

USA . 83 parts In-Stock

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$46.210

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$45.286

83

$46.210

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$45.286

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$46.210

100+ parts

$43.900

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$41.127

300

$46.210

$43.900

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$41.127

QUARKTWIN TECHNOLOGY LTD

USA . 19,791 parts In-Stock

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19,791

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RGB Technical Solutions

Ukraine . 3,450 parts In-Stock

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Perfect Parts

USA . 1,702 parts In-Stock

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1,702

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Argo Parts USA

USA . 231 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 102 parts In-Stock

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102

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GreenTree Electronics

Israel . 100 parts In-Stock

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100

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Legend Electronics Inc. (Excess)

USA . 100 parts In-Stock

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100

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Overview

Upgrade your telecom systems with the ZL50020QCG1 by Microchip Technology. Crafted with precision and quality in mind, this telecom switching IC offers unparalleled performance and reliability. Perfect for a wide range of applications, this product boasts advanced features that deliver exceptional value to customers. Say goodbye to connectivity issues and hello to seamless communication with the ZL50020QCG1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for telecom applications where weight and longevity are important factors.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it suitable for compact telecom equipment designs.

Power Supplies (V): 1.8, 3.3

Supporting multiple power supply options makes this product versatile and compatible with various system requirements.

No. of Terminals: 256

Having a high number of terminals allows for a greater level of connectivity and functionality in the telecom system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables high-density mounting on the PCB, optimizing space usage and increasing system performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions, ensuring reliable performance in various telecom environments.

Minimum Operating Temperature: -40 °C

The product's ability to operate at very low temperatures makes it suitable for use in extreme cold environments common in telecom infrastructure.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance, ensuring reliable electrical connections in the telecom system.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables a slim profile design, making it suitable for space-constrained telecom equipment.

Width: 28 mm

The compact width of the product allows for efficient use of space on the PCB, contributing to a streamlined and organized telecom system layout.

Length: 28 mm

The product's length is also optimized for space efficiency, ensuring that it can fit seamlessly into the overall design of the telecom equipment.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades, this product can operate reliably in harsh industrial environments, making it a durable choice for telecom applications.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and easy assembly during the manufacturing process.

Maximum Supply Current: 120 mA

With a maximum supply current of 120 mA, this product consumes low power, contributing to energy efficiency and reducing operating costs in the telecom system.

Telecom IC Type: DIGITAL TIME SWITCH

As a digital time switch, this product offers precise timing control in telecom applications, enabling efficient scheduling and management of various operations in the system.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V allows for compatibility with low-power circuits and helps in reducing overall power consumption in the telecom system.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm enables high-density mounting and precise connections on the PCB, enhancing the overall performance and reliability of the telecom system.

Technical Specifications

Telecom - Switching ICs ZL50020QCG1 attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G256

JESD-609 Code:

e3

Length:

28 mm

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP256,1.2SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

120 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

ZL50020QCG1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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