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ZL30109QDG1

Microchip Technology

ZL30109QDG1 by Microchip Technology

ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE;

Median Price

$41.130

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 1,440 parts In-Stock

1+ parts

$41.130

100+ parts

$31.170

1k+ parts

$28.790

10k+ parts

$27.310

1,440

$41.130

$31.170

$28.790

$27.310

Distributors (In-Stock)

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Bristol Electronics

USA . 47 parts In-Stock

1+ parts

$27.948

100+ parts

$25.796

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Electronics Depot

USA . 1,939 parts In-Stock

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Speed Components Ltd

Israel . 50 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 47 parts In-Stock

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Dan-Mar Components

USA . 47 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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LMD Electronica

Estonia . 6,868 parts In-Stock

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Montano Global Distributors

Canada . 5,899 parts In-Stock

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Kepictronics

USA . 1,120 parts In-Stock

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NIA Electronics

USA . 693 parts In-Stock

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Ledger Components

France . 693 parts In-Stock

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LOOK Integrated Logistics

Peru . 361 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 47 parts In-Stock

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Glotronic Ltd.

UK . 38 parts In-Stock

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Technical Specifications

ATM/SONET/SDH Circuits ZL30109QDG1 attributes and parameters. Explore more ATM/SONET/SDH Circuits devices from Microchip Technology

Specs

Applications:

SDH; SONET

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

PQFP64,.40SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

75 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

ZL30109QDG1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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