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VSC8582XKS-11

Microchip Technology

VSC8582XKS-11 by Microchip Technology

VSC8582XKS-11 by Microchip Technology is an Ethernet transceiver with 2 transceivers and a data rate of 1000 Mbps. It operates at temperatures from 0 to 125°C, with a supply voltage of 1V. This network interface IC in a square package is ideal for high-speed networking applications.

Median Price

$50.500

Lifecycle Status

Suppliers In-Stock

1

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,340 parts In-Stock

1+ parts

$50.500

100+ parts

$38.260

1k+ parts

$35.350

10k+ parts

$33.530

2,340

$50.500

$38.260

$35.350

$33.530

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 270 parts In-Stock

1+ parts

$34.780

100+ parts

-

1k+ parts

-

10k+ parts

-

270

$34.780

-

-

-

XL Components Corporation

Australia . 7,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,868

-

-

-

-

Marpe Global Electronics

Taiwan . 3,819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,819

-

-

-

-

QualityLine Systems

Poland . 526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

526

-

-

-

-

Overview

Elevate your network performance with the VSC8582XKS-11 by Microchip Technology. As a leading manufacturer in the industry, Microchip is known for delivering high-quality products that exceed expectations. The VSC8582XKS-11 falls under the Network Interfaces category and offers unparalleled value with its cutting-edge technology. Perfect for a wide range of applications, this Ethernet transceiver provides reliable connectivity at lightning-fast speeds of up to 1000 Mbps. Say goodbye to slow connections and hello to seamless communication with the VSC8582XKS-11.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices or products that may be subjected to rough handling.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, reducing assembly time and making the product suitable for compact designs.

No. of Terminals: 256

With a high number of terminals, this product can support complex network connections and data transfer requirements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can perform reliably even in demanding environmental conditions.

Maximum Supply Current: 1130 mA

The high maximum supply current indicates that the product can support power-hungry operations, making it suitable for high-performance networking applications.

Data Rate: 1000 Mbps

With a data rate of 1000 Mbps, this product provides fast and efficient data transmission, ideal for high-speed network connections.

Technical Specifications

Network Interfaces VSC8582XKS-11 attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

1000 Mbps

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

No. of Functions:

1

No. of Terminals:

256

No. of Transceivers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1.8 mm

Maximum Supply Current:

1130 mA

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

VSC8582XKS-11 Telecommunications trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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