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SY58025UMG

Microchip Technology

SY58025UMG by Microchip Technology

SY58025UMG by Microchip Technology is a differential mux with 2 functions and inputs, operating at 2.5V. With a propagation delay of 0.29ns, it is ideal for industrial applications requiring fast signal processing in a compact chip carrier package. It offers complementary outputs and operates within a wide temperature range from -40 to 85°C.

Median Price

$12.225

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 7,500 parts In-Stock

1+ parts

$9.690

100+ parts

$7.340

1k+ parts

$7.090

10k+ parts

-

7,500

$9.690

$7.340

$7.090

-

DigiKey

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$12.760

1k+ parts

-

10k+ parts

-

100

-

$12.760

-

-

Verical

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$14.575

1k+ parts

$13.037

10k+ parts

$12.275

100

-

$14.575

$13.037

$12.275

Rochester

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$11.690

1k+ parts

$10.460

10k+ parts

$9.840

70

-

$11.690

$10.460

$9.840

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semi Source

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,986 parts In-Stock

1+ parts

$34.216

100+ parts

-

1k+ parts

-

10k+ parts

-

1,986

$34.216

-

-

-

West Coast Incorporated

USA . 4,269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,269

-

-

-

-

Perfect Parts

USA . 243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

243

-

-

-

-

Overview

Upgrade your electronic designs with the SY58025UMG by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers top-notch quality products like this differential multiplexer that offers exceptional performance and reliability. Ideal for various applications, this device features two functions and inputs, making it versatile for your project needs. With a compact package style and low propagation delay, the SY58025UMG ensures efficiency and precision in your designs. Trust Microchip Technology to provide you with innovative solutions that bring value and benefits to your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making this product a convenient and cost-effective choice.

Propagation Delay (tpd): 0.29 ns

Low propagation delay ensures fast data transmission and high-speed operation, making this multiplexer/demultiplexer suitable for applications requiring quick response times.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain stable performance under varying temperatures.

Nominal Supply Voltage / Vsup (V): 2.5

The specified supply voltage ensures proper functionality of the device and is compatible with standard power sources, making it easy to integrate into existing systems.

Moisture Sensitivity Level (MSL): 2

A moisture sensitivity level of 2 indicates that the product has been tested for moisture resistance, ensuring reliability and longevity in humid environments.

Technical Specifications

Multiplexer & Demultiplexer SY58025UMG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Microchip Technology

Specs

Additional Features:

SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY

Family:

58025

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inputs:

2

No. of Inverted Outputs:

0

No. of Outputs:

1

No. of Terminals:

32

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

140 mA

Propagation Delay (tpd):

.29 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Trade Compliance

SY58025UMG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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