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SST26VF016BT-80E/SN70SVAO

Microchip Technology

SST26VF016BT-80E/SN70SVAO by Microchip Technology

SST26VF016BT-80E/SN70SVAO by Microchip: 16MX1 NOR Flash Memory, 104 MHz clock freq., SPI serial bus. Ideal for automotive applications with AEC-Q100 screening, -40 to 125 °C operating temp range, and 100000 write/erase cycles endurance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,813 parts In-Stock

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4,813

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Nova Conductors

Japan . 49 parts In-Stock

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49

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Distributors (Availability)

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Ampacity Inc.

Singapore . 12,621 parts In-Stock

1+ parts

$1.850

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12,621

$1.850

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AZTECH Wire

Italy . 802 parts In-Stock

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$15.010

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802

$15.010

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Fulton Briggs Corp.

USA . 7,925 parts In-Stock

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7,925

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Argo Parts USA

USA . 4,593 parts In-Stock

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4,593

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Microchip USA

USA . 2,825 parts In-Stock

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2,825

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Continental Prestige Electronics

USA . 1,035 parts In-Stock

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1,035

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Bastille Electronics

Australia . 29 parts In-Stock

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Overview

Unlock the power of reliable and high-quality flash memory with the SST26VF016BT-80E/SN70SVAO by Microchip Technology. As a leader in the industry, Microchip Technology ensures top-notch performance and durability in their products. Ideal for automotive applications, this flash memory offers fast data transfer speeds and secure data storage capabilities. With its small outline package and low power consumption, this product delivers exceptional value and benefits to customers looking for a dependable solution for their memory needs. Upgrade your technology with the SST26VF016BT-80E/SN70SVAO and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100; TS 16949

Compliant with automotive industry standards, ensuring high quality and performance in automotive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Operating Mode: SYNCHRONOUS

Synchronous operation provides precise timing control and efficient data transfer.

Nominal Supply Voltage: 3V

Compatible with common supply voltages, making it versatile for various applications.

No. of Terminals: 8

Provides a compact design while offering sufficient connectivity options.

Package Style: SMALL OUTLINE

Small outline package makes it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

Can function reliably in high-temperature environments, increasing overall product durability.

Organization: 16MX1

Provides high memory organization for storing a large amount of data efficiently.

Output Characteristics: 3-STATE

Allows for flexible output configurations and efficient data transmission.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low-temperature conditions, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position ensures secure connections and reduces the risk of disconnection.

Write Protection: HARDWARE/SOFTWARE

Offers multiple options for write protection, enhancing data security.

Maximum Seated Height: 1.75 mm

Low profile design allows for easy integration into compact devices.

Maximum Clock Frequency: 104 MHz

Supports high-speed data processing and efficient performance.

Width: 3.9 mm

Slim width enables efficient space utilization on circuit boards.

Minimum Supply Voltage: 2.7V

Operates reliably even at lower supply voltages, increasing flexibility in power requirements.

Type: NOR TYPE

NOR type memory technology provides fast read and write speeds, ideal for high-performance applications.

Length: 4.9 mm

Compact length facilitates space-saving designs in electronic devices.

Programming Voltage: 3V

Compatible programming voltage ensures ease of use and compatibility with standard programming equipment.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in harsh automotive environments.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, suitable for various battery-powered applications.

Parallel or Serial: SERIAL

Serial communication allows for efficient data transfer and simplified connectivity.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections for reliable performance.

Maximum Supply Current: 25 mA

Low supply current consumption for efficient power management.

No. of Words: 16777216 words

High word capacity provides ample storage for data-intensive applications.

Minimum Data Retention Time: 100

Minimum data retention time ensures data integrity and reliability.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into various circuit board designs.

No. of Words Code: 16M

Easy identification of memory capacity for efficient memory management.

Maximum Supply Voltage: 3.6V

High supply voltage tolerance for reliable operation in varying voltage conditions.

Endurance: 100000 Write/Erase Cycles

High endurance for extensive data read and write operations.

Serial Bus Type: SPI

SPI bus type enables efficient serial communication with other devices.

Memory Density: 16777216 bit

High memory density for storing a large amount of data in a compact form factor.

Memory IC Type: FLASH

FLASH memory technology offers fast read and write speeds, ideal for data-intensive applications.

Maximum Standby Current: 0.000045 Amp

Ultra-low standby current consumption for power-efficient operation.

Technical Specifications

Flash Memory SST26VF016BT-80E/SN70SVAO attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

3

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000045 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

3.9 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

SST26VF016BT-80E/SN70SVAO Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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