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PIC32MX270F256DT-50I/TL

Microchip Technology

PIC32MX270F256DT-50I/TL by Microchip Technology

PIC32MX270F256DT-50I/TL by Microchip: 32-bit, 50 MHz clock, 262144 ROM words. Ideal for industrial applications with ADC, DMA channels and peripherals like USB, PWM, RTC. Operating temp -40 to 85 °C; supply voltage range 2.3V to 3.6V suitable for various microcontroller projects.

Median Price

$7.261

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$7.261

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44

$7.261

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Vyrian

USA . 3,149 parts In-Stock

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3,149

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,684 parts In-Stock

1+ parts

$7.261

100+ parts

-

1k+ parts

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$7.116

2,684

$7.261

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$7.116

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.261

100+ parts

-

1k+ parts

$6.898

10k+ parts

$6.753

1,000

$7.261

-

$6.898

$6.753

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$7.407

100+ parts

$7.407

1k+ parts

$7.407

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-

5,000

$7.407

$7.407

$7.407

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Ampacity Inc.

Singapore . 586 parts In-Stock

1+ parts

$8.000

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586

$8.000

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AZTECH Wire

Italy . 521 parts In-Stock

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$8.613

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521

$8.613

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Semicontronic

India . 1,530 parts In-Stock

1+ parts

$14.000

100+ parts

$13.650

1k+ parts

$13.580

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1,530

$14.000

$13.650

$13.580

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Corohmni

South Africa . 86 parts In-Stock

1+ parts

$32.117

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86

$32.117

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Aztec Data Supply Inc.

USA . 4,748 parts In-Stock

1+ parts

$75.530

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$75.530

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XL Components Corporation

Australia . 8,013 parts In-Stock

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QualityLine Systems

Poland . 7,159 parts In-Stock

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7,159

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Marpe Global Electronics

Taiwan . 5,159 parts In-Stock

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Argo Parts USA

USA . 2,963 parts In-Stock

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Microchip USA

USA . 439 parts In-Stock

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439

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Overview

Elevate your projects with the PIC32MX270F256DT-50I/TL by industry leader Microchip Technology. This powerful microcontroller offers unparalleled performance and reliability, making it ideal for a wide range of applications. With advanced features like multiple ADC and DMA channels, USB connectivity, and a maximum clock frequency of 50 MHz, this chip provides endless possibilities for innovation. Trust in Microchip Technology's reputation for quality and let the PIC32MX270F256DT-50I/TL take your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly, making the product suitable for mass production.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages, providing flexibility and compatibility with various power sources.

Screening Level: TS 16949

High screening level ensures reliability and quality control, making the product suitable for automotive applications.

Package Shape: SQUARE

Square package shape enables efficient use of space on the PCB and allows for easy alignment during assembly.

Bit Size: 32

32-bit architecture provides high performance and processing capabilities, suitable for complex applications.

No. of Terminals: 44

Ample number of terminals allow for versatile connectivity options and interfacing with external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles provide flexibility in choosing the right form factor for specific application requirements.

Minimum Supply Voltage: 2.3 V

Low minimum supply voltage allows for operation in low-power scenarios and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environments and industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in extreme cold conditions, suitable for outdoor use.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides excellent conductivity, corrosion resistance, and ensures long-term reliability.

ADC Channels: YES

Built-in ADC channels enable analog input processing, making the product suitable for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels enhance data transfer efficiency and offload CPU, improving system performance and responsiveness.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and routing, optimizing space utilization and improving signal integrity.

ROM Words: 262144

Large ROM size accommodates extensive program storage and data logging, suitable for applications requiring significant memory capacity.

Maximum Seated Height: 1 mm

Low seated height minimizes the overall profile of the product, making it suitable for slim and compact designs.

Width: 6 mm

Compact width enables space-efficient PCB layout and integration into small enclosure designs.

Peripherals: BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT

Diverse set of peripherals enhance system functionality and flexibility, enabling a wide range of application possibilities.

Maximum Clock Frequency: 50 MHz

High clock frequency provides fast processing speed and responsiveness, suitable for real-time and computation-intensive tasks.

Length: 6 mm

Compact length complements the width, allowing for a small footprint on the PCB and efficient use of space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in challenging operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller IC type offer efficient processing and control capabilities, suited for embedded system applications.

RAM Bytes: 65536

Generous RAM size provides ample memory for data processing and storage, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing overall product efficiency.

Terminal Form: BUTT

Butt terminal form simplifies soldering and mounting processes, ensuring secure and reliable connections on the PCB.

Analog To Digital Convertors: 13-Ch 10-Bit

Multiple ADC channels with high resolution enable precise analog-to-digital conversion, essential for accurate sensor data acquisition.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable performance across various operating conditions.

PWM Channels: YES

PWM channels enable precise control of analog signals, making the product suitable for motor control, dimming, and other applications.

Connectivity: I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Multiple connectivity options offer versatile communication interfaces, supporting diverse inter-device communication requirements.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and customization, facilitating adaptability to changing application needs.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting, reducing PCB footprint and supporting compact device designs.

Speed: 50 rpm

High-speed performance capability allows for quick data processing and efficient system operation, suitable for time-sensitive applications.

On Chip Program ROM Width: 8

Wide on-chip program ROM width accommodates complex instruction sets and program storage, supporting advanced computing tasks.

No. of I/O Lines: 33

Sufficient number of I/O lines enable versatile interfacing with external sensors, actuators, and peripherals, enhancing system connectivity.

Technical Specifications

Microcontrollers PIC32MX270F256DT-50I/TL attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XBCC-B44

JESD-609 Code:

e4

Length:

6 mm

No. of I/O Lines:

33

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM, RTC, TIMER(5), USB, WDT

Analog To Digital Convertors:

13-Ch 10-Bit

Trade Compliance

PIC32MX270F256DT-50I/TL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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