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MCP2561FD-H/P

Microchip Technology

MCP2561FD-H/P by Microchip Technology

MCP2561FD-H/P by Microchip: CAN FD transceiver with 8 Mbps data rate, 5V supply voltage. Automotive grade for TS 16949 screening level. Ideal for network interfaces in automotive applications due to its high-speed communication capabilities.

Median Price

$1.460

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 5,650 parts In-Stock

1+ parts

$1.460

100+ parts

$1.110

1k+ parts

$1.070

10k+ parts

$1.060

5,650

$1.460

$1.110

$1.070

$1.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 4,500 parts In-Stock

1+ parts

$1.450

100+ parts

$1.310

1k+ parts

$1.170

10k+ parts

-

4,500

$1.450

$1.310

$1.170

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Vyrian

USA . 2,019 parts In-Stock

1+ parts

-

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2,019

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Vigor

Singapore . 4,976 parts In-Stock

1+ parts

$0.870

100+ parts

-

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4,976

$0.870

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-

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Semicontronic

India . 485 parts In-Stock

1+ parts

$1.240

100+ parts

$1.209

1k+ parts

$1.203

10k+ parts

-

485

$1.240

$1.209

$1.203

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Corohmni

South Africa . 178 parts In-Stock

1+ parts

$11.826

100+ parts

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178

$11.826

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Aztec Data Supply Inc.

USA . 2,075 parts In-Stock

1+ parts

$14.310

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2,075

$14.310

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AZTECH Wire

Italy . 578 parts In-Stock

1+ parts

$15.568

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578

$15.568

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Lixinc

USA . 14,059 parts In-Stock

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14,059

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Continental Prestige Electronics

USA . 6,580 parts In-Stock

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6,580

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RGB Technical Solutions

Ukraine . 5,180 parts In-Stock

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5,180

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Argo Parts USA

USA . 3,464 parts In-Stock

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3,464

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Revolutionize your automotive network interfaces with the MCP2561FD-H/P by Microchip Technology. This high-quality CAN FD transceiver offers unparalleled reliability and performance, making it the top choice for automotive applications. With a nominal supply voltage of 5V and a data rate of 8Mbps, this product delivers exceptional value to customers looking for seamless communication solutions. Trust in Microchip Technology's expertise to provide you with the best-in-class components for your automotive networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it a good choice for long-term use in network interfaces.

Screening Level: TS 16949

This high screening level ensures quality and consistency in performance, making it a reliable option for networking applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and space-saving design, making it ideal for compact networking setups.

No. of Terminals: 8

With multiple terminals, this product offers versatility and connectivity options, making it suitable for various networking configurations.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and organization, making it a convenient choice for network setups.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in diverse settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and longevity, ensuring uninterrupted connectivity in network interfaces.

Terminal Position: DUAL

Dual terminal positions offer redundancy and flexibility in connections, making this product a reliable choice for networking setups.

Maximum Seated Height: 5.334 mm

The low seated height allows for compact design and easy installation in confined spaces, making it a practical option for networking applications.

Technical Specifications

Network Interfaces MCP2561FD-H/P attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

8 Mbps

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.271 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Screening Level:

TS 16949

Maximum Seated Height:

5.334 mm

Maximum Supply Current:

70 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MCP2561FD-H/P Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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