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MCP2025T-500E/MD

Microchip Technology

MCP2025T-500E/MD by Microchip Technology

MCP2025T-500E/MD by Microchip: LIN transceiver for automotive apps. Operates at -40 to 125°C, 12V supply voltage. Small outline package with 8 terminals, matte tin finish, suitable for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,318 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Corohmni

South Africa . 822 parts In-Stock

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$6.720

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822

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Aztec Data Supply Inc.

USA . 156 parts In-Stock

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$6.792

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AZTECH Wire

Italy . 483 parts In-Stock

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$11.953

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Ampacity Inc.

Singapore . 547 parts In-Stock

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$192.000

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Lixinc

USA . 12,314 parts In-Stock

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Argo Parts USA

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RGB Technical Solutions

Ukraine . 1,993 parts In-Stock

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Aranea Global

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Continental Prestige Electronics

USA . 334 parts In-Stock

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Overview

Experience seamless networking with the MCP2025T-500E/MD by Microchip Technology. As a trusted leader in network interfaces, Microchip Technology ensures top-quality products that cater to various applications. The MCP2025T-500E/MD offers unmatched value with its reliable performance, durability, and innovative design. Whether you're in the automotive industry or looking for LIN transceivers, this product is your go-to solution. Upgrade your networking experience today with Microchip Technology's MCP2025T-500E/MD.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product ideal for use in automotive applications where weight and durability are important factors.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability of the product, meeting automotive industry standards.

Package Shape: SQUARE

Square package shape provides a compact form factor, suitable for applications where space is limited.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, enabling the device to communicate effectively with other components in the network.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand extreme heat conditions, making it reliable in various environments.

Minimum Operating Temperature: -40 °C

The product can operate effectively even in very low temperatures down to -40°C, making it suitable for use in cold climate regions.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides good conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: DUAL

Dual terminal position allows for versatile installation options, providing flexibility in PCB layout and design.

Maximum Seated Height: 1 mm

Low maximum seated height of 1 mm enables a slim profile design, saving space and making it suitable for compact electronic devices.

Width: 4 mm

Narrow width of 4 mm allows for efficient space utilization on the PCB, especially in tight layouts or crowded circuit boards.

Length: 4 mm

Compact length of 4 mm contributes to the overall small form factor of the product, ensuring it can fit in limited space environments.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the product is built to withstand harsh conditions and temperature fluctuations commonly encountered in vehicles.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with regulations, reducing the product's impact on the environment.

Telecom IC Type: LIN TRANSCEIVER

The LIN transceiver type is specifically designed for automotive networking applications, ensuring compatibility with LIN communication protocols.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12 V, the product is suitable for use in standard automotive electrical systems, providing stable and reliable performance.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8 mm, the product allows for high density mounting on the PCB, enabling efficient use of space and reducing signal interference.

Technical Specifications

Network Interfaces MCP2025T-500E/MD attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

4 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

MCP2025T-500E/MD Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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