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MCP2021-330E/MD

Microchip Technology

MCP2021-330E/MD by Microchip Technology

MCP2021-330E/MD by Microchip is a LIN transceiver with 8 terminals, operating at -40 to 125°C. It features a small outline package style and matte tin finish, suitable for automotive applications requiring a 12V supply voltage. The device is designed for surface mount assembly in TS 16949 compliant systems.

Median Price

$2.303

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.633

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.633

-

-

-

Bristol Electronics

USA . 342 parts In-Stock

1+ parts

$2.973

100+ parts

$1.397

1k+ parts

$1.278

10k+ parts

-

342

$2.973

$1.397

$1.278

-

Vyrian

USA . 6,672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,672

-

-

-

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ACDS - Activité Composants Distribution Service

France . 342 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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342

-

-

-

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Dan-Mar Components

USA . 342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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342

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,924 parts In-Stock

1+ parts

$1.633

100+ parts

-

1k+ parts

-

10k+ parts

$1.600

3,924

$1.633

-

-

$1.600

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.633

100+ parts

-

1k+ parts

$1.551

10k+ parts

$1.518

2,000

$1.633

-

$1.551

$1.518

Argo Parts USA

USA . 724 parts In-Stock

1+ parts

$1.633

100+ parts

-

1k+ parts

-

10k+ parts

-

724

$1.633

-

-

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Ampacity Inc.

Singapore . 593 parts In-Stock

1+ parts

$1.780

100+ parts

-

1k+ parts

-

10k+ parts

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593

$1.780

-

-

-

Semicontronic

India . 306 parts In-Stock

1+ parts

$1.780

100+ parts

$1.736

1k+ parts

$1.727

10k+ parts

-

306

$1.780

$1.736

$1.727

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Andel Nordic

Denmark . 2,210 parts In-Stock

1+ parts

$2.688

100+ parts

-

1k+ parts

$2.580

10k+ parts

$2.580

2,210

$2.688

-

$2.580

$2.580

Microchip USA

USA . 1,288 parts In-Stock

1+ parts

$13.650

100+ parts

-

1k+ parts

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10k+ parts

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1,288

$13.650

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Aztec Data Supply Inc.

USA . 152 parts In-Stock

1+ parts

$14.460

100+ parts

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152

$14.460

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Corohmni

South Africa . 505 parts In-Stock

1+ parts

$16.967

100+ parts

-

1k+ parts

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10k+ parts

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505

$16.967

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-

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AZTECH Wire

Italy . 746 parts In-Stock

1+ parts

$17.834

100+ parts

-

1k+ parts

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10k+ parts

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746

$17.834

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A-Z Elektronik GmbH

Germany . 5,892 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,892

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RGB Technical Solutions

Ukraine . 5,251 parts In-Stock

1+ parts

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5,251

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

-

-

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iodParts Technologies Inc.

India . 455 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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455

-

-

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Perfect Parts

USA . 413 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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413

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Overview

Discover the cutting-edge MCP2021-330E/MD by Microchip Technology, a top-tier network interface designed to exceed expectations. With a focus on quality and reliability, Microchip Technology leads the industry in providing innovative solutions for automotive applications. This LIN transceiver boasts a compact design, high temperature tolerance, and dual terminal position, making it ideal for a wide range of automotive networking tasks. Elevate your projects with the MCP2021-330E/MD, delivering exceptional value and performance that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and resources during production.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability in automotive applications, meeting strict industry standards.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, enabling compact designs in electronic systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and compatibility with various systems that require multiple connections.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enhances thermal management and overall performance of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand heat-intensive environments without compromising functionality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold conditions, making it suitable for diverse environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Terminal Position: DUAL

Having dual terminal positions offers design flexibility and ease of installation in different configurations, improving overall usability.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1mm, the product can be used in space-constrained applications without compromising performance.

Width: 4 mm

The compact width of 4mm allows for efficient use of space on a circuit board, contributing to streamlined design layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during assembly processes, leading to robust connections and long-lasting performance.

Length: 4 mm

The short length of 4mm contributes to a compact and space-saving design, making it suitable for applications with limited board real estate.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the product meets stringent temperature requirements and industry standards for use in automotive applications.

Terminal Form: NO LEAD

The use of no-lead terminal form aligns with environmental regulations and is environmentally friendly while maintaining high performance levels.

Telecom IC Type: LIN TRANSCEIVER

The LIN transceiver type is specifically designed for use in telecommunications applications, ensuring compatibility and optimal performance in communication systems.

Nominal Supply Voltage: 12 V

Having a nominal supply voltage of 12V makes the product suitable for applications that require consistent and stable power delivery at this voltage level.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting on a circuit board, enabling compact and efficient electronic designs.

Technical Specifications

Network Interfaces MCP2021-330E/MD attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

MCP2021-330E/MD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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