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M2GL060-FGG676

Microchip Technology

M2GL060-FGG676 by Microchip Technology

Microchip Technology's M2GL060-FGG676 is a PLASTIC/EPOXY FPGA with 676 terminals. It operates b/w 0-85 °C and has a supply voltage range of 1.14-1.26 V. Ideal for applications requiring high-speed data processing in compact electronic devices.

Median Price

$114.890

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 98 parts In-Stock

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$114.890

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$107.230

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Microchip Technology

USA . 6 parts In-Stock

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$114.890

100+ parts

$104.450

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$62.340

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6

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$62.340

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Future Electronics

Canada . 120 parts In-Stock

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$107.240

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120

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$107.240

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Distributors (In-Stock)

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Nova Conductors

Japan . 52 parts In-Stock

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$102.835

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Digiode

USA . 117 parts In-Stock

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$109.146

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Vyrian

USA . 6,951 parts In-Stock

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Chip Stock

USA . 581 parts In-Stock

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IBS Electronics

USA . 160 parts In-Stock

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$142.632

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Distributors (Availability)

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AZTECH Wire

Italy . 227 parts In-Stock

1+ parts

$9.770

100+ parts

$9.380

1k+ parts

$9.200

10k+ parts

$9.010

227

$9.770

$9.380

$9.200

$9.010

Ampacity Inc.

Singapore . 124 parts In-Stock

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$97.660

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Semicontronic

India . 124 parts In-Stock

1+ parts

$97.660

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$95.218

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$94.730

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124

$97.660

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$94.730

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Continental Prestige Electronics

USA . 4,369 parts In-Stock

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$102.835

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$100.778

4,369

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Netroflash

USA . 2,000 parts In-Stock

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$102.835

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$102.835

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Corphita

USA . 73 parts In-Stock

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$103.401

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Component Stockers USA

USA . 120 parts In-Stock

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$111.170

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Marpe Global Electronics

Taiwan . 3,002 parts In-Stock

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QualityLine Systems

Poland . 3,002 parts In-Stock

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XL Components Corporation

Australia . 3,002 parts In-Stock

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Argo Parts USA

USA . 2,077 parts In-Stock

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Overview

Unlock endless possibilities with the M2GL060-FGG676 by Microchip Technology. This top-quality FPGA offers unparalleled flexibility and customization for a wide range of applications. From advanced robotics to cutting-edge telecommunications, this innovative product delivers exceptional performance and reliability. Trust in Microchip Technology's renowned expertise to revolutionize your projects and stay ahead of the pack. Elevate your designs with the M2GL060-FGG676 and experience the true power of limitless potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resilience to the package, ensuring protection for the sensitive internal components of the FPGA.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage allows for flexibility in power requirements, accommodating various applications.

Nominal Supply Voltage (V): 1.2

The stable and reliable nominal supply voltage ensures consistent performance of the FPGA.

No. of Terminals: 676

With a large number of terminals, this FPGA can support complex connections and configurations, making it suitable for advanced projects.

Minimum Operating Temperature: 0 °C

The wide temperature range allows the FPGA to operate in diverse environments, increasing its versatility.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M2GL060-FGG676 attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

Trade Compliance

M2GL060-FGG676 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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