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M1AGL250V2-FGG144I

Microchip Technology

M1AGL250V2-FGG144I by Microchip Technology

M1AGL250V2-FGG144I by Microchip Technology is a CMOS FPGA with 6144 logic cells, 97 inputs/outputs, and 250,000 equivalent gates. It operates b/w -40 to 100°C, has a supply voltage range of 1.14-1.575 V, and uses a grid array package style. Ideal for industrial applications requiring high gate count and low profile design in a compact form factor.

Median Price

$33.207

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 78 parts In-Stock

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Digiode

USA . 388 parts In-Stock

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$34.096

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Vyrian

USA . 7,734 parts In-Stock

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Chip Stock

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AZTECH Wire

Italy . 700 parts In-Stock

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$5.712

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$11.195

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Aztec Data Supply Inc.

USA . 2,969 parts In-Stock

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Corohmni

South Africa . 131 parts In-Stock

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Semicontronic

India . 19 parts In-Stock

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$30.510

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$29.747

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$29.595

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Corphita

USA . 194 parts In-Stock

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Continental Prestige Electronics

USA . 150 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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$32.320

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$30.704

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Microchip USA

USA . 1,580 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,697 parts In-Stock

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LMD Electronica

Estonia . 5,710 parts In-Stock

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Montano Global Distributors

Canada . 5,064 parts In-Stock

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NIA Electronics

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Ledger Components

France . 4,468 parts In-Stock

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Argo Parts USA

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LOOK Integrated Logistics

Peru . 390 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the M1AGL250V2-FGG144I by Microchip Technology. This FPGA boasts 250,000 equivalent gates and 6,144 logic cells, providing unmatched performance and versatility for a wide range of applications. With a low profile grid array package and top-notch CMOS technology, this product delivers exceptional quality and reliability. Whether you're designing high-performance computing systems or advanced digital signal processing applications, the M1AGL250V2-FGG144I offers an unbeatable value proposition that will elevate your projects to new heights. Upgrade your designs with Microchip Technology and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 6144

A high number of logic cells allows for complex programmable logic designs to be implemented efficiently.

Maximum Supply Voltage: 1.575 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with various systems.

Technology Used: CMOS

The CMOS technology used offers low power consumption and high noise immunity, making the FPGA energy-efficient and reliable.

No. of Inputs: 97

Having a large number of inputs enables the FPGA to interface with multiple external devices and sensors, expanding its functionality.

No. of Equivalent Gates: 250000

The high number of equivalent gates allows for the implementation of complex digital circuits and algorithms, making the FPGA versatile.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage provides a standard operating voltage for the FPGA, ensuring compatibility with typical power sources.

No. of Terminals: 144

Having a sufficient number of terminals allows for easy connection and integration of the FPGA into a larger system.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows the FPGA to function reliably in harsh environmental conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) M1AGL250V2-FGG144I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

6144

No. of Inputs:

97

No. of Outputs:

97

No. of Equivalent Gates:

250000

Technology:

CMOS

Organization:

250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

13 mm

Width:

13 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA144,12X12,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

144

Standards

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

M1AGL250V2-FGG144I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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