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LE58QL021FJC

Microchip Technology

LE58QL021FJC by Microchip Technology

PCM CODEC; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Median Price

$7.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 75 parts In-Stock

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$7.000

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75

$7.000

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DF Sales Co.

USA . 75 parts In-Stock

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$7.000

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75

$7.000

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Electronics Depot

USA . 122 parts In-Stock

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Cyclops Electronics Ltd

UK . 8 parts In-Stock

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Distributors (Availability)

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Montano Global Distributors

Canada . 7,918 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,178 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Kepictronics

USA . 2,117 parts In-Stock

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NIA Electronics

USA . 2,033 parts In-Stock

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Ledger Components

France . 2,033 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,989 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,326 parts In-Stock

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LMD Electronica

Estonia . 1,270 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Microchip USA

USA . 146 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 54 parts In-Stock

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ChipstoGo Electronic ltd

UK . 21 parts In-Stock

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Technical Specifications

Audio Codecs LE58QL021FJC attributes and parameters. Explore more Audio Codecs devices from Microchip Technology

Specs

Maximum Analog Input:

3.465 V

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Linear Coding:

16-BIT

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

44

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.572 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

LE58QL021FJC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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