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LAN9311I-NZW

Microchip Technology

LAN9311I-NZW by Microchip Technology

Microchip Technology's LAN9311I-NZW is a telecom IC Ethernet switch with 128 terminals and a package size of 14mm x 14mm. It operates at temperatures ranging from -40 to 85 °C and requires a nominal voltage of 3.3V, making it suitable for industrial applications.

Median Price

$16.212

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 89 parts In-Stock

1+ parts

$4.930

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$4.930

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Arrow

USA . 67 parts In-Stock

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$14.730

100+ parts

$14.570

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67

$14.730

$14.570

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DigiKey

USA . 315 parts In-Stock

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$16.980

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$12.850

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315

$16.980

$12.850

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Microchip Technology

USA . 90 parts In-Stock

1+ parts

$16.980

100+ parts

$12.850

1k+ parts

$12.430

10k+ parts

$12.270

90

$16.980

$12.850

$12.430

$12.270

RS Americas

USA . 89 parts In-Stock

1+ parts

$16.980

100+ parts

$13.580

1k+ parts

$12.740

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-

89

$16.980

$13.580

$12.740

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Master Electronics

USA . 512 parts In-Stock

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$12.540

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512

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$12.540

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Verical

USA . 510 parts In-Stock

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$16.212

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510

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$16.212

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Distributors (In-Stock)

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Bristol Electronics

USA . 137 parts In-Stock

1+ parts

$12.336

100+ parts

$11.386

1k+ parts

$10.912

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137

$12.336

$11.386

$10.912

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Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$14.790

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37

$14.790

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Electro Sonic

Canada . 542 parts In-Stock

1+ parts

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100+ parts

$13.160

1k+ parts

$12.280

10k+ parts

$12.090

542

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$13.160

$12.280

$12.090

IBS Electronics

USA . 512 parts In-Stock

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$17.587

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512

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$17.587

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Dan-Mar Components

USA . 137 parts In-Stock

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137

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Vyrian

USA . 62 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 47 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 644 parts In-Stock

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$6.912

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644

$6.912

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Ampacity Inc.

Singapore . 108 parts In-Stock

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$8.380

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108

$8.380

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Continental Prestige Electronics

USA . 6,120 parts In-Stock

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$14.790

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$14.494

6,120

$14.790

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$14.494

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$14.790

100+ parts

$14.494

1k+ parts

$14.050

10k+ parts

$13.755

1,000

$14.790

$14.494

$14.050

$13.755

Kepictronics

USA . 26,279 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,580 parts In-Stock

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Lixinc

USA . 18,496 parts In-Stock

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Marpe Global Electronics

Taiwan . 5,679 parts In-Stock

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5,679

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XL Components Corporation

Australia . 4,315 parts In-Stock

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Argo Parts USA

USA . 2,289 parts In-Stock

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RC Electronics

USA . 1,854 parts In-Stock

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Perfect Parts

USA . 1,314 parts In-Stock

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QualityLine Systems

Poland . 1,221 parts In-Stock

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Metaverse IC Inc.

Canada . 243 parts In-Stock

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Infinite Electronics LLP (Excess)

. 76 parts In-Stock

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Overview

Discover the power of reliable and high-quality networking with the LAN9311I-NZW by Microchip Technology. As a leading manufacturer in the telecom industry, Microchip Technology delivers top-notch products that meet the highest standards. The LAN9311I-NZW is an Ethernet switch IC that offers seamless connectivity, enhanced performance, and robust functionality. With its compact design and wide temperature range, this product is perfect for various applications in telecommunications. Experience the value and advantages that the LAN9311I-NZW brings to your network – superior speed, efficiency, and reliability. Upgrade your networking capabilities with Microchip Technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the switching IC, enhancing its reliability and longevity.

Surface Mount: YES

With the surface mount capability, the switching IC can be easily and securely mounted on a printed circuit board, enabling seamless integration and space-saving design.

No. of Functions: 1

This switching IC offers a single versatile function, simplifying the design and optimizing efficiency, making it ideal for various telecom applications.

Screening Level: TS 16949

The TS 16949 screening level ensures stringent quality standards are met during the manufacturing process, guaranteeing the reliability, performance, and consistency of the switching IC.

Package Shape: SQUARE

The square package shape enables easy handling, placement, and assembly, contributing to a smoother manufacturing process and improved productivity.

Power Supplies (V): 3.3/3.6

Operating at both 3.3V and 3.6V power supplies, this switching IC offers flexible compatibility, allowing seamless integration into different telecom systems and circuits.

No. of Terminals: 128

With a substantial number of terminals, this switching IC provides extensive connectivity options, allowing for the integration of multiple components and facilitating complex telecom system designs.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The versatile package styles, including flatpack, heat sink/slug, thin profile, and fine pitch, cater to diverse installation requirements, ensuring compatibility and ease of use in various telecom setups.

Maximum Operating Temperature: 85°C

The high maximum operating temperature allows the switching IC to withstand demanding environmental conditions, ensuring stable and reliable performance even in challenging telecom environments.

Minimum Operating Temperature: -40°C

With a wide range of operating temperature, the switching IC can function reliably even in extremely cold environments, making it suitable for deployment in diverse telecom applications.

Technical Specifications

Telecom - Switching ICs LAN9311I-NZW attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

No. of Functions:

1

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3/3.6

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

295 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LAN9311I-NZW Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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