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JAN2N3740

Microchip Technology

JAN2N3740 by Microchip Technology

PNP; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): 4 A; Transistor Application: SWITCHING; Package Shape: ROUND;

Median Price

$21.000

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 1 parts In-Stock

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$8.227

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1

$8.227

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Voyager Components

USA . 8 parts In-Stock

1+ parts

$17.786

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$17.786

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$17.786

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$17.786

8

$17.786

$17.786

$17.786

$17.786

DF Sales Co.

USA . 32 parts In-Stock

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$21.000

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$21.000

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DF Sales Co.

USA . 32 parts In-Stock

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$21.000

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Ace Electronics

USA . 17 parts In-Stock

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$25.000

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TEDSS.com

USA . 1 parts In-Stock

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$29.000

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American Microsemiconductor Inc.

USA . 192 parts In-Stock

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$37.170

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Bristol Electronics

USA . 764 parts In-Stock

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ABC Electronics Ltd.

UK . 61 parts In-Stock

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Electronic Expediters

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Atlantic Semiconductor

USA . 35 parts In-Stock

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Speed Components Ltd

Israel . 34 parts In-Stock

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Resion

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Electronics Depot

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Elcom Components

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Semi Source

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$0.497

100+ parts

$0.452

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$0.408

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450

$0.497

$0.452

$0.408

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Component Stockers USA

USA . 5 parts In-Stock

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$33.640

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Marpe Global Electronics

Taiwan . 6,843 parts In-Stock

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Microchip USA

USA . 5,907 parts In-Stock

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QualityLine Systems

Poland . 3,067 parts In-Stock

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3,067

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XL Components Corporation

Australia . 1,640 parts In-Stock

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A-Plus Industry Inc.

USA . 7 parts In-Stock

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Technical Specifications

Power Bipolar Junction Transistors (BJT) JAN2N3740 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Microchip Technology

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

4 A

Maximum Collector-Emitter Voltage:

60 V

Configuration:

Minimum DC Current Gain (hFE):

3

JEDEC-95 Code:

TO-213AA

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

PNP

Qualification:

Qualified

Reference Standard:

MIL-19500/441

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

JAN2N3740 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-00-139-1931, 5961001391931

NIIN

001391931

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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