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HCS201-I/SN

Microchip Technology

HCS201-I/SN by Microchip Technology

HCS201-I/SN by Microchip Technology is a Telecom IC for data encryption circuits. It operates at -40 to 85°C with 5V supply voltage and 2mA current. This small outline package has Gull Wing terminals, TS16949 screening, and matte tin finish, making it ideal for secure communication applications.

Median Price

$1.410

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,200 parts In-Stock

1+ parts

$1.410

100+ parts

$1.290

1k+ parts

$1.200

10k+ parts

$1.130

2,200

$1.410

$1.290

$1.200

$1.130

DigiKey

USA . 700 parts In-Stock

1+ parts

$1.410

100+ parts

$1.290

1k+ parts

-

10k+ parts

-

700

$1.410

$1.290

-

-

Mouser Electronics

USA . 621 parts In-Stock

1+ parts

$1.410

100+ parts

$1.290

1k+ parts

-

10k+ parts

-

621

$1.410

$1.290

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 2,100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Futuretech Components

Singapore . 19,174 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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19,174

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-

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Lixinc

USA . 17,770 parts In-Stock

1+ parts

-

100+ parts

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17,770

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A-Z Elektronik GmbH

Germany . 11,902 parts In-Stock

1+ parts

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11,902

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Fulton Briggs Corp.

USA . 7,638 parts In-Stock

1+ parts

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7,638

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Epart123

USA . 3,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.350

10k+ parts

$1.350

3,101

-

-

$1.350

$1.350

Kepictronics

USA . 1,508 parts In-Stock

1+ parts

-

100+ parts

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1,508

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Alle Elektronik GmbH

Germany . 1,268 parts In-Stock

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100+ parts

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1,268

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Perfect Parts

USA . 56 parts In-Stock

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56

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Overview

Enhance the security of your telecom systems with the HCS201-I/SN by Microchip Technology. This high-quality encryption IC provides unparalleled protection against data breaches, ensuring the privacy and confidentiality of your communications. Its small outline package makes it easy to integrate into your designs, while its industrial temperature grade guarantees reliable performance in any environment. Trust Microchip Technology for cutting-edge solutions that deliver peace of mind and safeguard your valuable information. Upgrade your telecom systems today with the HCS201-I/SN and experience the benefits of superior encryption technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and making assembly more efficient.

Screening Level: TS 16949

Compliance with a high screening level ensures quality and reliability of the product, meeting industry standards.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easily integrated into various electronic devices.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can perform well under various environmental conditions.

Maximum Supply Current: 2 mA

Low supply current consumption helps in energy efficiency and prolongs battery life in portable devices.

Nominal Supply Voltage: 5 V

Standard supply voltage of 5V makes it compatible with common power sources.

Technical Specifications

Telecom - Encryption ICs HCS201-I/SN attributes and parameters. Explore more Telecom - Encryption ICs devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

2 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HCS201-I/SN Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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